Temat: waste printed circuit boards - Katalog OPAC zbiorów

Skocz do pozycji: 1.

Tytuł:: Copper recovery from waste printed circuit boards and the correlation of Cu, Pb, Zn by ionic liquid
Autorzy:: Li, F.
Chen, M.
Powiązania:: https://bibliotekanauki.pl/articles/208289.pdf
Data publikacji:: 2017
Wydawca:: Politechnika Wrocławska. Oficyna Wydawnicza Politechniki Wrocławskiej
Tematy:: electronic waste
printed circuit boards
heavy metals
waste disposal
metale ciężkie
odpady elektroniczne
odpad płytek drukowanych
miedź
Opis:: Waste printed circuit boards (WPCBs) contain not only harmful materials but also many valuable resources, especially metals, which attracts more and more attention from the public. In this study, a sulfonic acid functionalized ionic liquid ([BSO₃HPy]OTf) was used to recycle copper from WPCBs. Zinc and lead, represented as typical heavy metals, were chosen to study the leaching behavior and their relation to copper. Five factors such as particle size, ionic liquid (IL) concentration, H₂O dose, solid to IL ratio and temperature were investigated in detail. The results showed that copper leaching rate was high, up to 99.77%, and zinc leaching rate reached the highest value of 74.88% under the optimum conditions. Lead cannot be leached effectively and the leaching rate was mostly low than 10%, which indirectly indicated that [BSO₃HPy]OTf has a good selectivity to lead. Besides, the interaction of copper, lead and zinc was characterized macroscopically by means of statistical methods. The Spearman correlation analysis showed that copper and zinc had a highly positive correlation. Lead had little relation to copper, which to some extent indicated that the effect of zinc on copper leaching behavior was bigger than that of lead.
Źródło:: Environment Protection Engineering; 2017, 43, 4; 55-66
0324-8828
Pojawia się w:: Environment Protection Engineering
Dostawca treści:: Biblioteka Nauki

Artykuł

Zmień widok

na półce

Skocz do pozycji: 2.

Tytuł:: Recycling of non-metallic powder from printed circuit board waste as a filler material in a fiber reinforced polymer
Autorzy:: Kanchanapiya, P.
Pinyo, W.
Jareemit, S.
Kwonpongsagoon, S.
Powiązania:: https://bibliotekanauki.pl/articles/207195.pdf
Data publikacji:: 2015
Wydawca:: Politechnika Wrocławska. Oficyna Wydawnicza Politechniki Wrocławskiej
Tematy:: electronic waste
printed circuit boards
recycling
nonmetallic powder
filler material
fiber reinforced polymer
odpady elektroniczne
odpad płytek drukowanych
wykorzystanie odpadów
proszek niemetaliczny
recykling
materiał wypełniający
polimer wzmocniony włóknami
Opis:: Rapid growth in the electricity and electronics industry in Thailand has resulted in numerous problems with electrical waste management. Printed circuit board (PCB) components contain copper in an amount of approximately 10 wt. % and approximately 90 wt. % of non-conductive substrate made from fiberglass resin. In the recycling process, after copper is physically separated from PCB, only nonmetallic powder (NMP) will be left; that needs to be properly disposed of and managed. Therefore, this study is a proposal of suitable choices for NMP management. The results showed that NMP can be disposed in hazardous waste landfill. Furthermore, NMP can be recycled as a component in fiber- -reinforced polymer (FRP) of the following composition: coarse NMP 25%, fine NMP 25%, polyester 38.8%, hardener (Butanox type) 0.6%, catalyst (cobalt type) 0.6%, styrene monomer 10%. This FRP mixed with NMP can be properly processed into an artificial wall tile product in terms of mechanical properties, manufacturing processes and conditions of use.
Źródło:: Environment Protection Engineering; 2015, 41, 4; 151-166
0324-8828
Pojawia się w:: Environment Protection Engineering
Dostawca treści:: Biblioteka Nauki

Artykuł

Zmień widok

na półce

Informacja

Wyszukujesz frazę "waste printed circuit boards" wg kryterium: Temat

Źródło danych

Dostawca treści

Kolekcja

Rok wydania

Wydawca

Temat

Autor

Typ dokumentu

Język