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Wyszukujesz frazę "Lundstrom, M." wg kryterium: Autor


Wyświetlanie 1-2 z 2
Tytuł:
Development of characterization methods for adherent anode slimes in copper electrorefining
Autorzy:
Kiviluoma, M.
Aaltonen, M.
Aromaa, J.
Lundstrom, M.
Forsen, O.
Powiązania:
https://bibliotekanauki.pl/articles/110440.pdf
Data publikacji:
2016
Wydawca:
Politechnika Wrocławska. Oficyna Wydawnicza Politechniki Wrocławskiej
Tematy:
anode
slime
copper
electrorefining
nickel
lead
arsenic
Opis:
Adherent anode slimes can cause anode passivation in copper electrorefining and lower the efficiency of copper electrorefining. Declining concentrate grades cause larger impurity levels in anodes, thus creating larger quantities of slimes in the refining process. In order to investigate the characterization methods for adherent anode slimes in copper electrorefining, experiments were conducted for the Boliden Harjavalta Pori refinery material. Methods such as particle size determination, chemical (ICP) analysis, settling rate determination, XRD, SEM-SE, SEM-BSE and SEM-EDS were applied. In addition, adherent anode slime samples were compared to optical micrograph and SEM-BSE images of respective anode copper samples. It was shown that SEM-EDS and SEM-BSE provided precise information about phases formed during electrorefining. The settling rate and particle size had a correlation only with a copper content of anode slime. The main phases in the anode slime were copper and lead sulphates as well as copper-silver selenides. NiO was shown to be the major Ni-bearing phase in the adherent slime. Nickel, tellurium and lead had the strongest, whereas arsenic, selenium and antimony had the weakest tendency to report to the anode slime.
Źródło:
Physicochemical Problems of Mineral Processing; 2016, 52, 1; 295-302
1643-1049
2084-4735
Pojawia się w:
Physicochemical Problems of Mineral Processing
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Oxidative pressurized acid leaching of waste printed circuit boards
Autorzy:
Lundstrom, M.
Seisko, S.
Jascisak, J.
Orac, D.
Aromaa, J.
Havlik, T.
Forsen, O.
Powiązania:
https://bibliotekanauki.pl/articles/109824.pdf
Data publikacji:
2017
Wydawca:
Politechnika Wrocławska. Oficyna Wydawnicza Politechniki Wrocławskiej
Tematy:
batch leaching
sulfuric acid
copper
tin
gas formation
Opis:
The amount of waste printed circuit board (WPCB) increases continuously. There is an economic and environmental need to recover valuable metals from WPCBs. In this study, the applicability of oxidative pressurized acid leaching of WPCBs rich in copper and tin was investigated. The effect of leaching parameters such as temperature, partial oxygen pressure and chloride concentration on metal dissolution from WPCBs was studied in sulfuric acid media. It was shown that non-metallic elements present in WPCBs initiated gas formation, namely CO2 and CO, during oxidized pressure acid leach. Decomposition of plastic components already started at 90 °C with 1.5 MPa oxygen overpressure in the presence of 1 g/dm3 chlorides. Gas formation was shown to have a negative impact on the process since copper extraction was reduced to 27% compared to 80-90% extraction achieved from anode slimes used as a reference material. It was suggested that gas formation related to plastic components could have a severe impact on metal yields. The highest dissolution of tin equal to 36% was achieved at room temperature. It was found that higher temperature promoted tin hydrolysis.
Źródło:
Physicochemical Problems of Mineral Processing; 2017, 53, 2; 781-792
1643-1049
2084-4735
Pojawia się w:
Physicochemical Problems of Mineral Processing
Dostawca treści:
Biblioteka Nauki
Artykuł
    Wyświetlanie 1-2 z 2

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