- Tytuł:
- The influence of annealing (900?C) of ultra-thin PECVD silicon oxynitride layers
- Autorzy:
-
Mroczyński, R.
Głuszko, G.
Beck, R. B.
Jakubowski, A.
Ćwil, M.
Konarski, P.
Hoffman, P.
Schmeißer, D. - Powiązania:
- https://bibliotekanauki.pl/articles/308691.pdf
- Data publikacji:
- 2007
- Wydawca:
- Instytut Łączności - Państwowy Instytut Badawczy
- Tematy:
-
ultra-thin dielectrics
silicon oxynitride
PECVD
CMOS - Opis:
- This work reports on changes in the properties of ultra-thin PECVD silicon oxynitride layers after high- temperature treatment. Possible changes in the structure, composition and electrophysical properties were investigated by means of spectroscopic ellipsometry, XPS, SIMS and electrical characterization methods (C-V, I-V and charge- pumping). The XPS measurements show that SiOxNy is the dominant phase in the ultra-thin layer and high-temperature annealing results in further increase of the oxynitride phase up to 70% of the whole layer. Despite comparable thickness, SIMS measurement indicates a densification of the annealed layer, because sputtering time is increased. It suggests complex changes of physical and chemical properties of the investigated layers taking place during high-temperature annealing. The C-V curves of annealed layers exhibit less frequency dispersion, their leakage and charge-pumping currents are lower when compared to those of as-deposited layers, proving improvement in the gate structure trapping properties due to the annealing process.
- Źródło:
-
Journal of Telecommunications and Information Technology; 2007, 3; 16-19
1509-4553
1899-8852 - Pojawia się w:
- Journal of Telecommunications and Information Technology
- Dostawca treści:
- Biblioteka Nauki
Artykuł