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    Wyświetlanie 1-5 z 5
    Tytuł:
    Comparison of composition of ultra-thin silicon oxynitride layers fabricated by PECVD and ultrashallow rf plasma ion implantation
    Autorzy:
    Mroczyński, R.
    Bieniek, T.
    Beck, R. B.
    Ćwil, M.
    Konarski, P.
    Hoffman, P.
    Schmeißer, D.
    Powiązania:
    https://bibliotekanauki.pl/articles/308687.pdf
    Data publikacji:
    2007
    Wydawca:
    Instytut Łączności - Państwowy Instytut Badawczy
    Tematy:
    ultra-thin dielectrics
    oxynitride
    SIMS
    XPS
    PECVD
    Opis:
    In this paper differences in chemical composition of ultra-thin silicon oxynitride layers fabricated in planar rf plasma reactor are studied. The ultra-thin dielectric layers were obtained in the same reactor by two different methods: ultrashallow nitrogen implantation followed by plasma oxidation and plasma enhanced chemical vapour deposition (PECVD). Chemical composition of silicon oxynitride layers was investigated by means of X-ray photoelectron spectroscopy (XPS) and secondary ion mass spectrometry (SIMS). The spectroscopic ellipsometry was used to determine both the thickness and refractive index of the obtained layers. The XPS measurements show considerable differences between the composition of the fabricated layers using each of the above mentioned methods. The SIMS analysis confirms XPS results and indicates differences in nitrogen distribution.
    Źródło:
    Journal of Telecommunications and Information Technology; 2007, 3; 20-24
    1509-4553
    1899-8852
    Pojawia się w:
    Journal of Telecommunications and Information Technology
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    The influence of annealing (900?C) of ultra-thin PECVD silicon oxynitride layers
    Autorzy:
    Mroczyński, R.
    Głuszko, G.
    Beck, R. B.
    Jakubowski, A.
    Ćwil, M.
    Konarski, P.
    Hoffman, P.
    Schmeißer, D.
    Powiązania:
    https://bibliotekanauki.pl/articles/308691.pdf
    Data publikacji:
    2007
    Wydawca:
    Instytut Łączności - Państwowy Instytut Badawczy
    Tematy:
    ultra-thin dielectrics
    silicon oxynitride
    PECVD
    CMOS
    Opis:
    This work reports on changes in the properties of ultra-thin PECVD silicon oxynitride layers after high- temperature treatment. Possible changes in the structure, composition and electrophysical properties were investigated by means of spectroscopic ellipsometry, XPS, SIMS and electrical characterization methods (C-V, I-V and charge- pumping). The XPS measurements show that SiOxNy is the dominant phase in the ultra-thin layer and high-temperature annealing results in further increase of the oxynitride phase up to 70% of the whole layer. Despite comparable thickness, SIMS measurement indicates a densification of the annealed layer, because sputtering time is increased. It suggests complex changes of physical and chemical properties of the investigated layers taking place during high-temperature annealing. The C-V curves of annealed layers exhibit less frequency dispersion, their leakage and charge-pumping currents are lower when compared to those of as-deposited layers, proving improvement in the gate structure trapping properties due to the annealing process.
    Źródło:
    Journal of Telecommunications and Information Technology; 2007, 3; 16-19
    1509-4553
    1899-8852
    Pojawia się w:
    Journal of Telecommunications and Information Technology
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Challenges in ultrathin oxide layers formation
    Autorzy:
    Beck, R.B.
    Jakubowski, A.
    Łukasiak, L.
    Korwin-Pawłowski, M.
    Powiązania:
    https://bibliotekanauki.pl/articles/307646.pdf
    Data publikacji:
    2001
    Wydawca:
    Instytut Łączności - Państwowy Instytut Badawczy
    Tematy:
    silicon technology
    oxidation
    PECVD
    RTO
    gate oxide
    ultrathin
    layers
    Opis:
    In near future silicon technology cannot do without ultrathin oxides, as it becomes clear from the "Roadmap'2000". Formation, however, of such layers, creates a lot of technical and technological problems. The aim of this paper is to present the technological methods, that potentially can be used for formation of ultrathin oxide layers for next generations ICs. The methods are briefly described and their pros and cons are discussed.
    Źródło:
    Journal of Telecommunications and Information Technology; 2001, 1; 27-34
    1509-4553
    1899-8852
    Pojawia się w:
    Journal of Telecommunications and Information Technology
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Influence of RF ICP PECVD process parameters of diamond-like carbon films on DC bias and optical emission spectra
    Autorzy:
    Oleszkiewicz, W
    Markowski, J
    Srnanek, R
    Kijaszek, W
    Gryglewicz, J
    Kovac, J
    Tlaczala, M
    Powiązania:
    https://bibliotekanauki.pl/articles/173686.pdf
    Data publikacji:
    2013
    Wydawca:
    Politechnika Wrocławska. Oficyna Wydawnicza Politechniki Wrocławskiej
    Tematy:
    PECVD
    diamond-like carbon layers
    OES
    Raman spectroscopy
    AFM
    Opis:
    The work presents the results of a research carried out with PlasmaLab Plus 100 system, manufactured by Oxford Instruments Company. The system was configured for deposition of diamond-like carbon films by ICP PECVD method. The change of an initial value of DC bias was investigated as a function of set values of the generator power (RF generator and ICP generator) in the constant power of the RF generator operation mode. The research shows that the value of DC bias nearly linearly depends on the RF generator power value and is affected only in a small degree by the power of ICP discharge. The capability of an installed OES spectrometer has been used to ensure the same starting conditions for the deposition processes of DLC films. The analysis of OES spectra of RF plasma discharge used in the deposition processes shows that the increase in ICP discharge power value results in the increased efficiency of the ionization process of a gaseous precursor (CH4). The quality of deposited DLC layers was examined by Raman spectroscopy. Basing on the acquired Raman spectra, the theoretical content of sp3 bonds in the structure of the film was estimated. The content is ranging from 30% to 65% and depends on ICP PECVD deposition process parameters.
    Źródło:
    Optica Applicata; 2013, 43, 1; 109-115
    0078-5466
    1899-7015
    Pojawia się w:
    Optica Applicata
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Azotek krzemu stosowany w technologii planarnych fotodiod wykonanych na bazie InP
    Silicon nitride for InP based planar photodiode applications
    Autorzy:
    Zynek, J.
    Hejduk, K.
    Klima, K.
    Możdżonek, M.
    Stonert, A.
    Turos, A.
    Rzodkiewicz, W.
    Powiązania:
    https://bibliotekanauki.pl/articles/192312.pdf
    Data publikacji:
    2008
    Wydawca:
    Sieć Badawcza Łukasiewicz - Instytut Technologii Materiałów Elektronicznych
    Tematy:
    azotek krzemu
    PECVD
    fotodioda planarna
    InP
    silicon nitride
    planar photodiode
    Opis:
    Przeprowadzono badania warstw azotku krzemu osadzonych na płytkach z fosforku indu metodą PECVD (Plasma Enhanced Chemical Yapor Deposition) z wykorzystaniem do wytwarzania plazmy dwóch generatorów pracujących na różnych częstotliwościach. Celem badań było ustalenie warunków wytwarzania warstw azotku krzemu stosowanych w technologii planarnych fotodiod wykonanych na bazie InP, w których obszarem absorpcyjnym są studnie kwantowe z InxGa1-xAs. Warstwy azotku krzemu były osadzane w temperaturach pomiędzy 250°C i 300°C. Podstawą do oceny wytworzonych warstw były wyniki badań: ich składu chemicznego, struktury, współczynnika załamania, poziomu naprężeń, rezystywności, wytrzymałości dielektrycznej, stałej dielektrycznej i efektywnej gęstości powierzchniowej ładunków elektrycznych. Stwierdzono, że warstwy osadzane w temperaturze 250°C mają najlepszą strukturę, dobrze spełniają rolę maski w procesie selektywnej dyfuzji cynku, a właściwości elektryczne umożliwiają wykorzystanie ich do pasywacji powierzchni bocznych złącz p-n, pod warunkiem zastosowania odpowiedniego cyklu wygrzewań po procesie osadzania.
    Silicon nitride films, deposited on InP wafers by the PECVD (Plasma Enhanced Chemical Vapor Deposition) method, have been investigated in terms of their applicability in the technology of InP based planar photodiodes with the InxGa1-xAs quantum well absorption region. In order to compensate the mechanical stress in the films, the plasma was excited by two radio-frequency sources operating at frequencies of 13,56 MHz and 100 kHz. The films were deposited at different temperatures in the range of 250 - 300°C. The chemical composition of all examined films, determined by the RBS (Rutherford Backscattering Spectrometry) method, is very close to that of stoichiometric Si3N4. The films contain a large amount of hydrogen. The hydrogen content, evaluated by the NRA (Nuclear Reactions Analysis) technique, exceeds 30 %. The silicon nitride films deposited at 300°C have grown much faster on InP wafers than on Si wafers placed beside these and the structure of both films is different. As the films deposited on Si are amorphous with smooth surfaces, the films deposited on InP are heterogeneous with rough surfaces. These last ones exhibit lower Si-N bond concentration, lower refractive index, higher extinction coefficient, lower resistivity and lower dielectric breakdown strength than the films deposited on silicon. Deterioration of the film quality is caused probably by the reaction of phosphorus, released from the InP substrate at the beginning of the deposition process, with deposited SiNx:H. Such films should not be used in the fabrication of InP based planar photodiodes. When the deposition temperature decreases, the properties of silicon nitride films improve. Their structure becomes more homogeneous and the Si-N bond concentration increases. The silicon nitride films deposited on InP at 250°C have the same amorphous structure and the same Si-N bond concentration, determined from FTIR (Fourier Transform Infrared Spectroscopy) absorption characteristics, as the films deposited on silicon. They exhibit the highest refractive index, the lowest extinction coefficient, the highest resistivity and the highest dielectric breakdown strength. These films are continuous, they do not crack during thermal processes and they can be applied as masking layers for the selective Zn diffusion used to form the p-n junctions. Unfortunately the films deposited at 250°C have the highest hydrogen content and the highest effective charge density. These films cannot be applied directly to passivate the p-n junction side surfaces. Measurements of hydrogen depth profiles and of FTIR absorption characteristics have revealed that the amount of hydrogen and of Si-N, Si-H and N-H bonds changed during annealing. An analysis of C-V characteristics of Al/Si3N4:H/InP MIS capacitors containing these films has shown, that annealing of the Si3N4:H films reduced the electronic defect state density at the Si3N4:H/InP interface. It is possible to take advantage of the thermal instability of silicon nitrides deposited by the PECVD method and to reduce the trap state density and the effective charge density by proper annealing processes. These investigations have enabled us to achieve reverse current values as low as 4 - 15 pA at the voltage of - 5 V and 200 - 500 pA at the voltage of -50 V for planar InP diodes with the 320 um diameter p-n junction. A high yield of 90 % is obtained. These results make a good base for development of planar photodiodes with InxGa1-xAs quantum wells inserted into the depletion region of the InP p-n junction.
    Źródło:
    Materiały Elektroniczne; 2008, T. 36, nr 4, 4; 95-113
    0209-0058
    Pojawia się w:
    Materiały Elektroniczne
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
      Wyświetlanie 1-5 z 5

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