- Tytuł:
- Impact of thermal fatigue on young’s modulus of epoxy adhesives
- Autorzy:
- Kłonica, M.
- Powiązania:
- https://bibliotekanauki.pl/articles/102676.pdf
- Data publikacji:
- 2015
- Wydawca:
- Stowarzyszenie Inżynierów i Techników Mechaników Polskich
- Tematy:
-
Young's modulus
epoxy adhesive
Hysol 9466
Hysol 3421
thermal shock - Opis:
- The following paper presents a comparative analysis of two epoxy-based adhesives: Hysol 9466 and Hysol 3421, prior to and after thermal shock testing. The tests focused on determining Young’s modulus. Epoxy-based materials are among the most widespread adhesive materials used as universal structural adhesives. The prepared epoxy samples (Hysol 9466 and Hysol 3421) were subjected to thermal shock cycling tests, according to a specified programme, in a thermal shock testing chamber, at a temperature range –40 °C to +60 °C and in the number of 200 cycles. Conclusions from the tests are presented at the final stage of the paper.
- Źródło:
-
Advances in Science and Technology. Research Journal; 2015, 9, 28; 103-106
2299-8624 - Pojawia się w:
- Advances in Science and Technology. Research Journal
- Dostawca treści:
- Biblioteka Nauki
Artykuł