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Wyświetlanie 1-2 z 2
Tytuł:
Dilatometric Analysis of the Sintering Behavior of Bi2Te3 Thermoelectric Powders
Autorzy:
Han, Ju-Yeon
Byun, Jong Min
Lee, Young-In
Choi, Byung Joon
Kim, Hogyoung
Oh, Sung-Tag
Powiązania:
https://bibliotekanauki.pl/articles/354899.pdf
Data publikacji:
2020
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
Bi2Te3
dilatometric analysis
sintering behavior
microstructure
Opis:
The sintering behavior of p-type bismuth telluride powder is investigated by means of dilatometric analysis. The alloy powders, prepared by ball milling of melt-spun ribbons, exhibit refined and flake shape. Differential thermal analysis reveals that the endothermic peak at about 280°C corresponds to the melting of bismuth, and peaks existing between 410°C and 510°C are presumably due to the oxidation and crystallization of the powder. The shrinkage behavior of ball-milled powders was strongly dependent of heating rate by the thermal effect exerted on specimens. In the case of 2°C/min, the peak temperature for the densification is measured at 406°C, while the peak temperature at a heating rate of 20°C/min is approximately 443°C. The relative density of specimen pressureless-sintered at 500°C exhibited relatively low value, and thus further study is required in order to increase the density of sintered body.
Źródło:
Archives of Metallurgy and Materials; 2020, 65, 3; 1117-1120
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Sn-Pd-Ni Electroplating on Bi2Te3-Based Thermoelectric Elements for Direct Thermocompression Bonding and Creation of a Reliable Bonding Interface
Autorzy:
Kang, Seok Jun
Bae, Sung Hwa
Son, Injoon
Powiązania:
https://bibliotekanauki.pl/articles/2049169.pdf
Data publikacji:
2021
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
tin electroplating
thermoelectric module
thermocompression bonding
Bi2Te3
direct bonding
Opis:
The Sn-Ag-Cu-based solder paste screen-printing method has primarily been used to fabricate Bi2Te3-based thermoelectric (TE) modules, as Sn-based solder alloys have a low melting temperature (approximately 220°C) and good wettability with Cu electrodes. However, this process may result in uneven solder thickness when the printing pressure is not constant. Therefore, we suggested a novel direct-bonding method between the Bi2Te3-based TE elements and the Cu electrode by electroplating a 100 μm Sn/ 1.3 μm Pd/ 3.5 μm Ni bonding layer onto the Bi2Te3-based TE elements. It was determined that there is a problem with the amount of precipitation and composition depending on the pH change, and that the results may vary depending on the composition of Pd. Thus, double plating layers were formed, Ni/Pd, which were widely commercialized. The Sn/Pd/Ni electroplating was highly reliable, resulting in a bonding strength of 8 MPa between the thermoelectric and Cu electrode components, while the Pd and Ni electroplated layer acted as a diffusion barrier between the Sn layer and the Bi2Te3 TE. This process of electroplating Sn/Pd/Ni onto the Bi2Te3 TE elements presents a novel method for the fabrication of TE modules without using the conventional Sn-alloy-paste screen-printing method.
Źródło:
Archives of Metallurgy and Materials; 2021, 66, 4; 963-966
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
    Wyświetlanie 1-2 z 2

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