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Wyszukujesz frazę "Yener, S." wg kryterium: Autor


Wyświetlanie 1-2 z 2
Tytuł:
An Evaluation of Cu-B₄C Composites Manufactured by Powder Metallurgy
Autorzy:
Yener, T.
Altinsoy, I.
Yener, S.
Celebi Efe, G.
Ozbek, I.
Bindal, C.
Powiązania:
https://bibliotekanauki.pl/articles/1401279.pdf
Data publikacji:
2015-04
Wydawca:
Polska Akademia Nauk. Instytut Fizyki PAN
Tematy:
81.05.Ni
81.20.Ev
72.80.Tm
Opis:
In this study, the influences of B₄C ratios on some mechanical and physical properties such as relative density, microhardness and electrical properties of cold pressed Cu-B₄C composites were investigated. Curve fitting is applied for the estimation of electrical conductivity. Commercial copper powders with 40 μm particle size were reinforced with B₄C, with particle size of 40 μm, at ratios of 1, 2, 3 wt.%, for improving mechanical properties of copper used as electrical conductor. Cu-B₄C composites have been fabricated by powder sintering process at a temperature of 900°C for 2 h. The presence of Cu and B₄C, which are dominant components in the sintered composites, were confirmed by X-ray diffraction analysis technique and SEM-EDS. Scanning electron microscope (SEM-EDS) has shown that B₄C particles are distributed homogenously in the copper matrix. The relative densities of Cu and Cu-B₄C composites, sintered at 900°C, ranged from 95.7 to 91.6%. Microhardness of composites ranged from 84.5 to 94.6 HB. It was observed that cold pressed Cu-1 wt.% B₄C composites revealed promising physical properties. Results of electrical conductivity measurement of Cu-B₄C composite material are compared to the results of the model and the overall accuracy level above 96% is obtained.
Źródło:
Acta Physica Polonica A; 2015, 127, 4; 1045-1047
0587-4246
1898-794X
Pojawia się w:
Acta Physica Polonica A
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Comparing of Commercial and Cemented Cu-SiC Composites
Autorzy:
Celebi Efe, G.
Altinsoy, I.
Yener, T.
Ipek, M.
Zeytin, S.
Bindal, C.
Powiązania:
https://bibliotekanauki.pl/articles/1287723.pdf
Data publikacji:
2014-02
Wydawca:
Polska Akademia Nauk. Instytut Fizyki PAN
Tematy:
81.05.Bx
81.05.Je
81.05.Ni
Opis:
SiC with 30 μm particle size reinforced copper composites have been fabricated by powder metallurgy method and sintered at 700C for 2 h in open atmosphere. Copper powder was produced by cementation method and obtained as commercial for comparing. Cemented and commercial copper powders were reinforced with SiC having 30 μm particle size at ratios of 0, 1, 2, 3, and 5 wt% for improving mechanical properties of copper without decreasing the electrical conductivity. The presence of Cu and SiC which are dominant components in the sintered composites were confirmed by X-ray diffraction analyses technique. Scanning electron microscope showed that SiC particles are distributed homogeneously in the copper matrix. The relative densities of Cu and Cu-SiC composites sintered at 700C are ranged from 98.0% to 96.2% for commercial Cu-SiC composites, 97.55 to 95.0% for cemented Cu-SiC composites, microhardness of composites ranged from 133 to 277 HV for commercial Cu-SiC composites and 127 to 229 HV for cemented Cu-SiC composites, and the electrical conductivity of composites changed between 95.6%IACS and 77.2%IACS for commercial Cu-SiC composites, 91.7%IACS and 69%IACS for cemented Cu-SiC composites. It was observed that there is a good agreement between cemented Cu-SiC and commercial Cu-SiC composites.
Źródło:
Acta Physica Polonica A; 2014, 125, 2; 417-419
0587-4246
1898-794X
Pojawia się w:
Acta Physica Polonica A
Dostawca treści:
Biblioteka Nauki
Artykuł
    Wyświetlanie 1-2 z 2

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