- Tytuł:
- Microstructure and Mechanical Properties of Lead-Free Solder Joints
- Autorzy:
-
Harcuba, P.
Trško, L. - Powiązania:
- https://bibliotekanauki.pl/articles/1402146.pdf
- Data publikacji:
- 2015-10
- Wydawca:
- Polska Akademia Nauk. Instytut Fizyki PAN
- Tematy:
-
06.60.Vz
67.80.bf
71.20.Lp - Opis:
- In this study we investigated the morphology and growth kinetics of the interfacial intermetallic compound layers formed between a Cu substrate and Sn-Cu based solders. We simulated the wave soldering process and subsequent ageing both at different temperatures and reaction times. The near eutectic Sn-0.7Cu alloy and Ni enriched Sn-0.7Cu-0.05Ni alloy were studied. Moreover, we measured the tensile strength of the simulated solder joints and analyzed fracture surfaces.
- Źródło:
-
Acta Physica Polonica A; 2015, 128, 4; 750-753
0587-4246
1898-794X - Pojawia się w:
- Acta Physica Polonica A
- Dostawca treści:
- Biblioteka Nauki
Artykuł