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Wyszukujesz frazę "Aydin, G." wg kryterium: Autor


Wyświetlanie 1-2 z 2
Tytuł:
Optical and Structural Properties of Bismuth Doped ZnO Thin Films by Sol-Gel Method: Urbach Rule as a Function of Crystal Defects
Autorzy:
Keskenler, E.
Aydın, S.
Turgut, G.
Doğan, S.
Powiązania:
https://bibliotekanauki.pl/articles/1205375.pdf
Data publikacji:
2014-08
Wydawca:
Polska Akademia Nauk. Instytut Fizyki PAN
Tematy:
78.20.-e
78.66.Hf
78.40.Fy
78.66.Jg
68.37.Yz
68.55.ag
68.60.Bs
Opis:
Bismuth (Bi) doped zinc oxide (ZnO:Bi) thin films were prepared on glass substrates by sol-gel spin coating technique using homogeneous precursor solutions, and effects of Bi doping on the structural and optical properties of ZnO were investigated. The crystalline of ZnO films shifted from polycrystalline nature to amorphous nature with Bi doping. The plane stresses (σ) for hexagonal ZnO and ZnO:Bi crystals were calculated according to the biaxial strain model. The Urbach rule was studied as a function of non-thermal component to the disorder (defects in crystal structures) which is especially observed in the case of non-crystal semiconductors. The calculated Urbach energies and steepness parameters of undoped ZnO and ZnO:Bi films varied between 44.33 meV and 442.67 meV, and 58.3 × $10^{-2}$ and 5.8 × $10^{-2}$, respectively. The Urbach energies of the films increased with an increase in the Bi doping concentration and a great difference was observed for 7.0 mol.% doping. The band gap values of the films exhibited a fluctuated behavior as a result of doping effect.
Źródło:
Acta Physica Polonica A; 2014, 126, 3; 782-786
0587-4246
1898-794X
Pojawia się w:
Acta Physica Polonica A
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Influence of Aging Procedure on Bonding Strength and Thermal Conductivity of Plywood Panels
Autorzy:
Demirkir, C.
Colakoglu, G.
Colak, S.
Aydin, I.
Candan, Z.
Powiązania:
https://bibliotekanauki.pl/articles/1398989.pdf
Data publikacji:
2016-06
Wydawca:
Polska Akademia Nauk. Instytut Fizyki PAN
Tematy:
88.20.rp
87.85.jf
Opis:
Wood and wood composite materials have been used in house, school, and office construction throughout the world. Wood composite materials are superior to other building materials in terms of thermal conductivity due to its porous structure. Bonding strength and thermal conductivity are two of many other significant properties of composite panels used in construction. It was essential to determine the effect of ageing process on the properties of panels used in structural applications. This study evaluates thermal conductivity and bonding strength of Scots pine and black pine plywood panels manufactured from rotary cut veneers dried at three different temperatures: 110°C, 140°C, and 160°C. Phenol formaldehyde (PF) and melamine urea formaldehyde (MUF) were used as adhesives for plywood manufacturing. Panels were exposed to ageing process according to ASTM C 481-99 standard. Plywood panels with five plies and 10 mm thickness were manufactured for each group. Thermal conductivity and bonding strength values of plywood panels were determined. Thermal conductivity of the panels decreased with increase of the drying temperature. It was also found that the thermal conductivity of test panels decreased after the ageing process. Shear strength mean values obtained from the samples of all plywood panels were above the limit value (1.0 N/mm²) indicated in TS EN 314-2 standard but those of the panels with MUF after ageing process.
Źródło:
Acta Physica Polonica A; 2016, 129, 6; 1230-1234
0587-4246
1898-794X
Pojawia się w:
Acta Physica Polonica A
Dostawca treści:
Biblioteka Nauki
Artykuł
    Wyświetlanie 1-2 z 2

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