- Tytuł:
- Selective Cu Electrodeposition on Micrometer Trenches Using Microcontact Printing and Additives
- Autorzy:
-
Shim, Jinyong
Lee, Jinhyun
Yoo, Bongyoung - Powiązania:
- https://bibliotekanauki.pl/articles/2049262.pdf
- Data publikacji:
- 2021
- Wydawca:
- Polska Akademia Nauk. Czytelnia Czasopism PAN
- Tematy:
-
µCP
selective Cu deposition
RDL
overburden
SAM(alkanethiol)
additives - Opis:
- Selective deposition was performed on a micrometer trench pattern using a microcontact printing (μCP) process. Alkanethiols required for selective deposition were analyzed according to the carbon chain by linear sweep voltammetry (LSV). According to the LSV analysis, the effect of inhibiting Cu deposition depending on the length of the carbon chain was observed. During the Cu electrodeposition, the trench could be filled without voids by additives (PEG, SPS, JGB) in the plating solution. A μCP process suppressing the deposition of the sample was used for selective Cu electrodeposition. However, there was oxidation and instability of the sample and 1-hexadecanethiol in air. To overcome these problems, the μCP method was performed in a glove box to achieve effective inhibition.
- Źródło:
-
Archives of Metallurgy and Materials; 2021, 66, 3; 741-744
1733-3490 - Pojawia się w:
- Archives of Metallurgy and Materials
- Dostawca treści:
- Biblioteka Nauki
Artykuł