Temat: low temperature cofired ceramic - Katalog OPAC zbiorów

Skocz do pozycji: 1.

Tytuł:: Design of Millimeter-Wave Six-Port Device for LTCC Technology
Autorzy:: Słojewska, Barbara
Yashchyshyn, Yevhen
Powiązania:: https://bibliotekanauki.pl/articles/227071.pdf
Data publikacji:: 2020
Wydawca:: Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:: low temperature cofired ceramic
LTCC
microwave technology
millimeter wave
six-port network
Opis:: In this paper a design of millimeter-wave six-port device for LTCC (Low Temperature Cofired Ceramic) technology is presented. Furthermore, problems with implementation of the project taking into account requirements of LTCC technology are discussed.
Źródło:: International Journal of Electronics and Telecommunications; 2020, 66, 1; 37-43
2300-1933
Pojawia się w:: International Journal of Electronics and Telecommunications
Dostawca treści:: Biblioteka Nauki

Artykuł

Skocz do pozycji: 2.

Tytuł:: Analysis of Substrate Integrated Waveguide (SIW) Resonator and Design of Miniaturized SIW Bandpass Filter
Autorzy:: Rhbanou, A.
Bri, S.
Sabbane, M.
Powiązania:: https://bibliotekanauki.pl/articles/226670.pdf
Data publikacji:: 2017
Wydawca:: Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:: integrated waveguide
dielectric materials
cavity resonator
band-pass filter
low temperature cofired ceramic
Opis:: In this paper, the substrate integrated waveguide (SIW) resonator is designed to study the influence of dielectric materials on its operating parameters (insertion loss, fractional bandwidth and unloaded Q-factor). The results obtained show that the use of high permittivity substrate in the SIW resonator by increasing its thickness allows reducing the size of resonator by causing the increase in its unloaded Q-factor. A SIW bandpass filter is designed using low temperature co-fired ceramic (LTCC) technology and high permittivity substrate. The filter has a fractional bandwidth of 27 % centered at 14.32 GHz with insertion loss of 0.7 dB.
Źródło:: International Journal of Electronics and Telecommunications; 2017, 63, 3; 255-260
2300-1933
Pojawia się w:: International Journal of Electronics and Telecommunications
Dostawca treści:: Biblioteka Nauki

Artykuł

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