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Wyszukujesz frazę "electroplating" wg kryterium: Temat

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    Wyświetlanie 1-3 z 3
    Tytuł:
    Thermal Diffusion of 57Co into Rh Foil for Preparing Mössbauer Source
    Autorzy:
    Uhm, Y. R.
    Kim, J. J.
    Choi, S. M.
    Son, K. J.
    Powiązania:
    https://bibliotekanauki.pl/articles/352775.pdf
    Data publikacji:
    2017
    Wydawca:
    Polska Akademia Nauk. Czytelnia Czasopism PAN
    Tematy:
    Mössbauer source
    diffusion
    electroplating
    57Co/Rh
    Opis:
    To establish the coating conditions for 57 Co, non-radioactive Co ions are dissolved in an acid solution and electroplated on to a rhodium plate. The thermal diffusion of electroplated Co into a rhodium matrix was studied to apply a 57 Co Mössbauer source. The procedure to form a Co deposited onto Rh foil was established using two different electroplating baths: the acid-based buffer (pH 3) containing boric acid, sodium chloride, and saccharin, and the alkaline-based buffer (pH 10) containing hydrazine hydrate and ammonium citrate. The influence of different annealing conditions was investigated. From the results, the best diffusion degree of electrodeposited Co onto the rhodium matrix was obtained in an annealing process performed at 1100°C for 3 h in vacuum over 10-5 hPa.
    Źródło:
    Archives of Metallurgy and Materials; 2017, 62, 2B; 1249-1252
    1733-3490
    Pojawia się w:
    Archives of Metallurgy and Materials
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Effect of Fe Content on the Contact Resistance of Electroplated Au-Fe Alloy Layers
    Autorzy:
    Park, H. S.
    Son, I.
    Powiązania:
    https://bibliotekanauki.pl/articles/352468.pdf
    Data publikacji:
    2018
    Wydawca:
    Polska Akademia Nauk. Czytelnia Czasopism PAN
    Tematy:
    electroplating
    Au-Fe alloy
    contact resistance
    thermal aging
    Opis:
    In this study, variations in the contact resistance of electroplated Au-Fe alloy layers with Fe content were investigated. The contact resistance of electroplated Au-Fe alloy layers that were subject to thermal aging at 260°C in the atmosphere, tended to increase significantly with an increase in the Fe content. Through an analysis method employing X-ray photoelectron spectroscopy (XPS/ESCA) and Auger electron spectroscopy (AES), Ni oxides, such as NiO and Ni2O3, on the surface of the thermally aged electroplated Au-Fe alloy layers were observed. It is believed that the Ni oxide existing on the surface diffused from the underlying electroplated Ni layers to the surface through the grain boundaries in the electroplated Au-Fe layers during the thermal aging. As the Fe content in the electroplated Au-Fe layers increased, the grain size decreased. As the grain size decreases, more Ni oxide was detected on the surface. Therefore, with a rise in the Fe content, more Ni diffuses to the surface via grain boundaries, and more Ni oxide is formed on the surface of the electroplated Au-Fe layers, increasing the contact resistance of the electroplated Au-Fe alloy layers.
    Źródło:
    Archives of Metallurgy and Materials; 2018, 63, 3; 1503-1507
    1733-3490
    Pojawia się w:
    Archives of Metallurgy and Materials
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Sn-Pd-Ni Electroplating on Bi2Te3-Based Thermoelectric Elements for Direct Thermocompression Bonding and Creation of a Reliable Bonding Interface
    Autorzy:
    Kang, Seok Jun
    Bae, Sung Hwa
    Son, Injoon
    Powiązania:
    https://bibliotekanauki.pl/articles/2049169.pdf
    Data publikacji:
    2021
    Wydawca:
    Polska Akademia Nauk. Czytelnia Czasopism PAN
    Tematy:
    tin electroplating
    thermoelectric module
    thermocompression bonding
    Bi2Te3
    direct bonding
    Opis:
    The Sn-Ag-Cu-based solder paste screen-printing method has primarily been used to fabricate Bi2Te3-based thermoelectric (TE) modules, as Sn-based solder alloys have a low melting temperature (approximately 220°C) and good wettability with Cu electrodes. However, this process may result in uneven solder thickness when the printing pressure is not constant. Therefore, we suggested a novel direct-bonding method between the Bi2Te3-based TE elements and the Cu electrode by electroplating a 100 μm Sn/ 1.3 μm Pd/ 3.5 μm Ni bonding layer onto the Bi2Te3-based TE elements. It was determined that there is a problem with the amount of precipitation and composition depending on the pH change, and that the results may vary depending on the composition of Pd. Thus, double plating layers were formed, Ni/Pd, which were widely commercialized. The Sn/Pd/Ni electroplating was highly reliable, resulting in a bonding strength of 8 MPa between the thermoelectric and Cu electrode components, while the Pd and Ni electroplated layer acted as a diffusion barrier between the Sn layer and the Bi2Te3 TE. This process of electroplating Sn/Pd/Ni onto the Bi2Te3 TE elements presents a novel method for the fabrication of TE modules without using the conventional Sn-alloy-paste screen-printing method.
    Źródło:
    Archives of Metallurgy and Materials; 2021, 66, 4; 963-966
    1733-3490
    Pojawia się w:
    Archives of Metallurgy and Materials
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
      Wyświetlanie 1-3 z 3

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