- Tytuł:
- Examinations of Selected Thermal Properties of Packages of SiC Schottky Diodes
- Autorzy:
-
Bisewski, D.
Myśliwiec, M.
Górecki, K.
Kisiel, R.
Zarębski, J. - Powiązania:
- https://bibliotekanauki.pl/articles/220523.pdf
- Data publikacji:
- 2016
- Wydawca:
- Polska Akademia Nauk. Czytelnia Czasopism PAN
- Tematy:
-
Schottky diodes
transient thermal impedance
thermal measurements
silicon carbide
packaging - Opis:
- This paper describes the study of thermal properties of packages of silicon carbide Schottky diodes. In the paper the packaging process of Schottky diodes, the measuring method of thermal parameters, as well as the results of measurements are presented. The measured waveforms of transient thermal impedance of the examined diodes are compared with the waveforms of this parameter measured for commercially available Schottky diodes.
- Źródło:
-
Metrology and Measurement Systems; 2016, 23, 3; 451-459
0860-8229 - Pojawia się w:
- Metrology and Measurement Systems
- Dostawca treści:
- Biblioteka Nauki
Artykuł