Informacja

Drogi użytkowniku, aplikacja do prawidłowego działania wymaga obsługi JavaScript. Proszę włącz obsługę JavaScript w Twojej przeglądarce.

Wyszukujesz frazę "Młożniak, A." wg kryterium: Autor


Wyświetlanie 1-2 z 2
Tytuł:
Sintered nanosilver joints on rigid and flexible substrates
Autorzy:
Kiełbasiński, K.
Szałapak, J.
Młożniak, A.
Teodorczyk, M.
Pawłowski, R.
Krzemiński, J.
Jakubowska, M.
Powiązania:
https://bibliotekanauki.pl/articles/201549.pdf
Data publikacji:
2018
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
silver nanopowder
pressure sintering
thermal conductivity
nanoproszek srebra
spiekanie ciśnieniowe
przewodność cieplna
Opis:
Because of new EU laws restricting the use of harmful substances (i.e. Pb because of the RoHS Directive), the search for new methods of joining has become highly urgent. The main problem for most solutions known to date has been to achieve good electrical parameters while maintaining low sintering temperaturatures. Pastes based on silver nanoparticles were developed, which allow to sinter below 300 ° C. Those layers have sheet resistance below 2 mΩ/sq. Low exposure to heat allows to use these pastes on elastic substrates such as paper or Kapton foil. In present work, the authors proved that it is possible to obtain joints on elastic substrates which can withstand over 30 000 cycles in bend test, with sintering in 300°C, by means of the Low Temperature Joining Technique (LTJT).
Źródło:
Bulletin of the Polish Academy of Sciences. Technical Sciences; 2018, 66, 3; 325-331
0239-7528
Pojawia się w:
Bulletin of the Polish Academy of Sciences. Technical Sciences
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
A Method Of Calculating Thermal Diffusivity And Conductivity For Irregularly Shaped Specimens In Laser Flash Analysis
Autorzy:
Szałapak, J.
Kiełbasiński, K.
Krzemiński, J.
Młożniak, A.
Zwierkowska, E.
Jakubowska, M.
Pawłowski, R.
Powiązania:
https://bibliotekanauki.pl/articles/220433.pdf
Data publikacji:
2015
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
thermal diffusivity
LFA
LTJT joints
high power electronics
Opis:
The Low Temperature Joining Technique (LTJT) using silver compounds enables to significantly increase the thermal conductivity between joined elements, which is much higher than for soldered joints. However, it also makes difficult to measure the thermal conductivity of the joint. The Laser Flash Analysis (LFA) is a non-intrusive method of measuring the temperature rise of one surface of a specimen after excitation with a laser pulse of its other surface. The main limitation of the LFA method is its standard computer software, which assumes the dimensions of a bonded component to be similar to those of the substrate, because it uses the standard Parker’s formula dedicated for one-dimensional heat flow. In the paper a special design of measured specimen was proposed, consisting of two copper plates of different size joined with the sintered silver layer. It was shown that heat properties of these specimens can also be measured after modifying the LFA method. The authors adapted these specimens by masking the false heat signal sourced from the uncovered plate area. Another adaptation was introducing a correcting factor of the heat travel distance, which was calculated with heat-flow simulations and placed into the Parker’s formula. The heat-flow simulated data were compared with the real LFA measurement results, which enabled estimation of the joint properties, e.g. its porosity.
Źródło:
Metrology and Measurement Systems; 2015, 22, 4; 521-530
0860-8229
Pojawia się w:
Metrology and Measurement Systems
Dostawca treści:
Biblioteka Nauki
Artykuł
    Wyświetlanie 1-2 z 2

    Ta witryna wykorzystuje pliki cookies do przechowywania informacji na Twoim komputerze. Pliki cookies stosujemy w celu świadczenia usług na najwyższym poziomie, w tym w sposób dostosowany do indywidualnych potrzeb. Korzystanie z witryny bez zmiany ustawień dotyczących cookies oznacza, że będą one zamieszczane w Twoim komputerze. W każdym momencie możesz dokonać zmiany ustawień dotyczących cookies