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    Tytuł:
    Recycling of non-metallic powder from printed circuit board waste as a filler material in a fiber reinforced polymer
    Autorzy:
    Kanchanapiya, P.
    Pinyo, W.
    Jareemit, S.
    Kwonpongsagoon, S.
    Powiązania:
    https://bibliotekanauki.pl/articles/207195.pdf
    Data publikacji:
    2015
    Wydawca:
    Politechnika Wrocławska. Oficyna Wydawnicza Politechniki Wrocławskiej
    Tematy:
    electronic waste
    printed circuit boards
    recycling
    nonmetallic powder
    filler material
    fiber reinforced polymer
    odpady elektroniczne
    odpad płytek drukowanych
    wykorzystanie odpadów
    proszek niemetaliczny
    recykling
    materiał wypełniający
    polimer wzmocniony włóknami
    Opis:
    Rapid growth in the electricity and electronics industry in Thailand has resulted in numerous problems with electrical waste management. Printed circuit board (PCB) components contain copper in an amount of approximately 10 wt. % and approximately 90 wt. % of non-conductive substrate made from fiberglass resin. In the recycling process, after copper is physically separated from PCB, only nonmetallic powder (NMP) will be left; that needs to be properly disposed of and managed. Therefore, this study is a proposal of suitable choices for NMP management. The results showed that NMP can be disposed in hazardous waste landfill. Furthermore, NMP can be recycled as a component in fiber- -reinforced polymer (FRP) of the following composition: coarse NMP 25%, fine NMP 25%, polyester 38.8%, hardener (Butanox type) 0.6%, catalyst (cobalt type) 0.6%, styrene monomer 10%. This FRP mixed with NMP can be properly processed into an artificial wall tile product in terms of mechanical properties, manufacturing processes and conditions of use.
    Źródło:
    Environment Protection Engineering; 2015, 41, 4; 151-166
    0324-8828
    Pojawia się w:
    Environment Protection Engineering
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Evaluation of the efficiency of metal recovery from printed circuit boards using gravity processes
    Autorzy:
    Franke, Dawid M.
    Suponik, Tomasz
    Nuckowski, Paweł M.
    Dubaj, Justyna
    Powiązania:
    https://bibliotekanauki.pl/articles/1445935.pdf
    Data publikacji:
    2021
    Wydawca:
    Politechnika Wrocławska. Oficyna Wydawnicza Politechniki Wrocławskiej
    Tematy:
    metals recovery
    printed circuit board
    gravity separation
    ICP-AES
    SEM-EDS
    Opis:
    This paper evaluates the efficiency of metal recovery from printed circuit boards (PCBs) using two gravity separation devices: a shaking table and a cyclofluid separator. The test results were compared with the results obtained from previous research, where an electrostatic separation process was used for an identically prepared feed. The feed for the separators consisted of PCBs shredded in a knife mill at cryogenic temperatures. The separation efficiency and purity of the products were evaluated based on microscopic analysis, ICP-AES, SEM-EDS, XRD, and specific density. The yield of concentrates (valuable metals) obtained from the shaking table and the cyclofluid separator amounted to 25.7% and 18.9%, respectively. However, the concentrate obtained from the cyclofluid separator was characterised by much higher purity, amounting to ~88% of valuable metals, compared to ~72% for the shaking table. In both cases, middlings formed a significant share, their yield amounting to ~25%, with the share of valuable metals of ~15%. The yield of waste obtained from the shaking table and the cyclofluid separator were 42.6% and 52.5%, respectively. In both cases, as a result of the applied process, the waste was divided into two homogeneous groups differing in grain size and shape. The recovery of metals through gravity separation is possible, in particular, by using a shaking table. These processes can also be applied to separate waste (plastics) into two groups to be selectively processed to produce new materials in line with a circular economy.
    Źródło:
    Physicochemical Problems of Mineral Processing; 2021, 57, 4; 63-77
    1643-1049
    2084-4735
    Pojawia się w:
    Physicochemical Problems of Mineral Processing
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Research on composite manufacturing method of semi-buried 1×32 optical splitter
    Autorzy:
    Tao, Qing
    Xie, Sihao
    Powiązania:
    https://bibliotekanauki.pl/articles/27310089.pdf
    Data publikacji:
    2023
    Wydawca:
    Politechnika Wrocławska. Oficyna Wydawnicza Politechniki Wrocławskiej
    Tematy:
    optical splitter
    composite manufacturing method
    EOPCB
    electro-optical printed circuit board
    Opis:
    In this paper, a composite manufacturing method was proposed to reduce the inner surface roughness of silica groove. Firstly, femtosecond laser was used to ablate the silica groove, then, a 5% concentration hydrofluoric acid solution was used to corrode the inner surface of silica groove. Secondly, Su8 adhesive was filled with the groove to form a semi-buried 1×32 optical splitter by doctor blade. The test results showed that the surface roughness Ra was less than 0.2 μm, and average insertion loss of output ports was 21.34 dB, moreover, the uniformity was less than 1.44 dB. Compared with the traditional femtosecond laser ablating method, surface roughness reduced by at least 0.1 μm, and the average insertion loss of output ports was reduced by 1.22 dB, and the uniformity was reduced by 0.41 dB. So, the composite manufacturing method improved the communication performance. It is satisfied with the requirements for optical interconnection in the electro-optical printed circuit boards.
    Źródło:
    Optica Applicata; 2023, 53, 2; 185--197
    0078-5466
    1899-7015
    Pojawia się w:
    Optica Applicata
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
      Wyświetlanie 1-3 z 3

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