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Wyświetlanie 1-2 z 2
Tytuł:
A Comparative Study of Single- and Dual-Threshold Voltage SRAM Cells
Autorzy:
Kushwaha, P.
Chaudhry, A.
Powiązania:
https://bibliotekanauki.pl/articles/308384.pdf
Data publikacji:
2011
Wydawca:
Instytut Łączności - Państwowy Instytut Badawczy
Tematy:
5T SRAM
65 nm CMOS technology
6T SRAM
7T SRAM
low power SRAM
power reduction technique
Opis:
In this paper, a comparison has been drawn between 5 transistor (5T), 6T and 7T SRAM cells. All the cells have been designed using both single-threshold (conventional) and dual-threshold (dual-Vt) voltage techniques. Their respective delays and power consumption have been calculated at 180 nm and 65 nm CMOS technology. With technology scaling, power consumption decreases by 80% to 90%, with some increase in write time because of the utilization of high- Vt transistors in write critical path. The results show that the read delay of 7T SRAM cell is 9% lesser than 5T SRAM cell and 29% lesser than 6T SRAM cell due to the lower resistance of the read access delay path. While read power of 5T SRAM cell is reduced by 10% and 24% as compared to 7T SRAM, 6T SRAM cell respectively. The write speed, however, is degraded by 1% to 3% with the 7T and 5T SRAM cells as compared to the 6T SRAM cells due to the utilization of single ended architecture. While write power of 5T SRAM cell is reduced by up to 40% and 67% as compared to 7T SRAM, 6T SRAM cell respectively.
Źródło:
Journal of Telecommunications and Information Technology; 2011, 4; 124-130
1509-4553
1899-8852
Pojawia się w:
Journal of Telecommunications and Information Technology
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Advanced compact modeling of the deep submicron technologies
Autorzy:
Grabiński, W.
Bucher, M.
Sallese, J.-M.
Krummenacher, F.
Powiązania:
https://bibliotekanauki.pl/articles/309312.pdf
Data publikacji:
2000
Wydawca:
Instytut Łączności - Państwowy Instytut Badawczy
Tematy:
ultra deep submicron (UDSM) technology
compact modeling
EKV MOS transistor model
MOSFET
matching
low power
RF applications
Opis:
The technology of CMOS large-scale integrated circuits (LSI's) achieved remarkable advances over last 25 year and the progress is expected to continue well into the next century. The progress has been driven by the downsizing of the active devices such as MOSFETs. Approaching these dimensions, MOSFET characteristics cannot be accurately predicted using classical modeling methods currently used in the most common MOSFET models such as BSIM, MM9 etc, without introducing large number of empirical parameters. Various physical effects that needed to be considered while modeling UDSM devices: quantization of the inversion layer, mobility degradation, carrier velocity saturation and overshoot, polydepletion effects, bias dependent source/drain resistances and capacitances, vertical and lateral doping profiles, etc. In this paper, we will discuss the progress in the CMOS technology and the anticipated difficulties of the sub-0.25 žm LSI downsizing. Subsequently, basic MOSFET modeling methodologies that are more appropriate for UDSM MOSFETs will be presented as well. The advances in compact MOSFET devices will be illustrated using application examples of the EPFL EKV model
Źródło:
Journal of Telecommunications and Information Technology; 2000, 3-4; 31-42
1509-4553
1899-8852
Pojawia się w:
Journal of Telecommunications and Information Technology
Dostawca treści:
Biblioteka Nauki
Artykuł
    Wyświetlanie 1-2 z 2

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