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Wyświetlanie 1-2 z 2
Tytuł:
Application of Improved Robust Kalman Filter in Data Fusion for PPP/INS Tightly Coupled Positioning System
Autorzy:
Li, Z.
Yao, Y.
Wang, J.
Gao, J.
Powiązania:
https://bibliotekanauki.pl/articles/221374.pdf
Data publikacji:
2017
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
PPP/INS tightly coupled positioning
robust filter
IGG scheme
Mahalanobis distance
Opis:
A robust Kalman filter improved with IGG (Institute of Geodesy and Geophysics) scheme is proposed and used to resist the harmful effect of gross error from GPS observation in PPP/INS (precise point positioning/inertial navigation system) tightly coupled positioning. A new robust filter factor is constructed as a three-section function to increase the computational efficiency based on the IGG principle. The results of simulation analysis show that the robust Kalman filter with IGG scheme is able to reduce the filter iteration number and increase efficiency. The effectiveness of new robust filter is demonstrated by a real experiment. The results support our conclusion that the improved robust Kalman filter with IGG scheme used in PPP/INS tightly coupled positioning is able to remove the ill effect of gross error in GPS pseudorange observation. It clearly illustrates that the improved robust Kalman filter is very effective, and all simulated gross errors added to GPS pseudorange observation are successfully detected and modified.
Źródło:
Metrology and Measurement Systems; 2017, 24, 2; 289-301
0860-8229
Pojawia się w:
Metrology and Measurement Systems
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Analysis Of Factors Affecting Gravity-Induced Deflection For Large And Thin Wafers In Flatness Measurement Using Three-Point-Support Method
Autorzy:
Liu, H.
Dong, Z.
Kang, R.
Zhou, P.
Gao, S.
Powiązania:
https://bibliotekanauki.pl/articles/220380.pdf
Data publikacji:
2015
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
flatness measurement
large and thin silicon wafer
GID
three-point-support method
initial stress
Opis:
Accurate flatness measurement of silicon wafers is affected greatly by the gravity-induced deflection (GID) of the wafers, especially for large and thin wafers. The three-point-support method is a preferred method for the measurement, in which the GID uniquely determined by the positions of the supports could be calculated and subtracted. The accurate calculation of GID is affected by the initial stress of the wafer and the positioning errors of the supports. In this paper, a finite element model (FEM) including the effect of initial stress was developed to calculate GID. The influence of the initial stress of the wafer on GID calculation was investigated and verified by experiment. A systematic study of the effects of positioning errors of the support ball and the wafer on GID calculation was conducted. The results showed that the effect of the initial stress could not be neglected for ground wafers. The wafer positioning error and the circumferential error of the support were the most influential factors while the effect of the vertical positioning error was negligible in GID calculation.
Źródło:
Metrology and Measurement Systems; 2015, 22, 4; 531-546
0860-8229
Pojawia się w:
Metrology and Measurement Systems
Dostawca treści:
Biblioteka Nauki
Artykuł
    Wyświetlanie 1-2 z 2

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