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Wyszukujesz frazę "Dong, Z." wg kryterium: Autor


Wyświetlanie 1-3 z 3
Tytuł:
Analysis Of Factors Affecting Gravity-Induced Deflection For Large And Thin Wafers In Flatness Measurement Using Three-Point-Support Method
Autorzy:
Liu, H.
Dong, Z.
Kang, R.
Zhou, P.
Gao, S.
Powiązania:
https://bibliotekanauki.pl/articles/220380.pdf
Data publikacji:
2015
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
flatness measurement
large and thin silicon wafer
GID
three-point-support method
initial stress
Opis:
Accurate flatness measurement of silicon wafers is affected greatly by the gravity-induced deflection (GID) of the wafers, especially for large and thin wafers. The three-point-support method is a preferred method for the measurement, in which the GID uniquely determined by the positions of the supports could be calculated and subtracted. The accurate calculation of GID is affected by the initial stress of the wafer and the positioning errors of the supports. In this paper, a finite element model (FEM) including the effect of initial stress was developed to calculate GID. The influence of the initial stress of the wafer on GID calculation was investigated and verified by experiment. A systematic study of the effects of positioning errors of the support ball and the wafer on GID calculation was conducted. The results showed that the effect of the initial stress could not be neglected for ground wafers. The wafer positioning error and the circumferential error of the support were the most influential factors while the effect of the vertical positioning error was negligible in GID calculation.
Źródło:
Metrology and Measurement Systems; 2015, 22, 4; 531-546
0860-8229
Pojawia się w:
Metrology and Measurement Systems
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
A novel method for 3D measurement of RFID multi-tag network using a machine vision system
Autorzy:
Zhuang, X.
Yu, X.
Zhao, Z.
Zhang, W.
Liu, Z.
Lu, D.
Dong, D.
Powiązania:
https://bibliotekanauki.pl/articles/221058.pdf
Data publikacji:
2018
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
3D measurement
RFID multi-tag network
dual-CCD system
neural network
machine vision
Opis:
The three-dimensional (3D) coordinate measurement of radio frequency identification (RFID) multi-tag networks is one of the important issues in the field of RFID, which affects the reading performance of RFID multi-tag networks. In this paper, a novel method for 3D coordinate measurement of RFID multi-tag networks is proposed. A dual-CCD system (vertical and horizontal cameras) is used to obtain images of RFID multi-tag networks from different angles. The iterative threshold segmentation and the morphological filtering method are used to process the images. The template matching method is respectively used to determine the two-dimensional (2D) coordinate and the vertical coordinate of each tag. After that, the 3D coordinate of each tag is obtained. Finally, a back-propagation (BP) neural network is used to model the nonlinear relationship between the RFID multi-tag network and the corresponding reading distance. The BP neural network can predict the reading distances of unknown tag groups and find out the optimal distribution structure of the tag groups corresponding to the maximum reading distance. In the future work, the corresponding in-depth research on the neural network to adjust the distribution of tags will be done.
Źródło:
Metrology and Measurement Systems; 2018, 25, 3; 475-486
0860-8229
Pojawia się w:
Metrology and Measurement Systems
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
An improved resonant thermal converter based on micro-bridge resonator
Autorzy:
Dong, L.
Han, J.
Zhang, P.
Zhao, Z.
Cheng, B.
Han, D.
Powiązania:
https://bibliotekanauki.pl/articles/220878.pdf
Data publikacji:
2018
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
thermoelectric transfer difference
micro-bridge resonator
thermal converter
bifilar heater
Opis:
This paper presents the design, fabrication and testing of an improved thin-film thermal converter based on an electro-thermally excited and piezo-resistively detected micro-bridge resonator. The resonant thermal converter comprises a bifilar heater and an opposing micro-bridge resonator. When the micro-bridge resonator absorbs the radiant heat from the heater, its axial strain changes, then its resonant frequency follows. Therefore the alternating voltage or current can be transferred to the equivalent DC quantity. A non-contact temperature sensing mechanism eliminates heat loss from thermopiles and reduces coupling capacitance between the temperature sensor and the heater compared with traditional thin-film thermal converters based on thermopiles. In addition, the quasi-digital output of the resonant thin-film thermal converter eliminates such problems as intensity fluctuations associated with analogue signals output by traditional thin-film thermal converters. Using the fast-reversed DC (FRDC) method, the thermoelectric transfer difference, which determines the frequency-independent part of the ac-dc transfer difference, is evaluated to be as low as 1.1 · 10-6. It indicates that the non-contact temperature sensing mechanism is a feasible method to develop a high-performance thermal converter.
Źródło:
Metrology and Measurement Systems; 2018, 25, 4; 715-725
0860-8229
Pojawia się w:
Metrology and Measurement Systems
Dostawca treści:
Biblioteka Nauki
Artykuł
    Wyświetlanie 1-3 z 3

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