- Tytuł:
- The use of CAD programs for designing special instrumentation in adhesive technologies
- Autorzy:
-
Ogrodniczek, J. T.
Pyda, A.
Kłonica, M. - Powiązania:
- https://bibliotekanauki.pl/articles/101856.pdf
- Data publikacji:
- 2018
- Wydawca:
- Politechnika Lubelska. Polskie Towarzystwo Promocji Wiedzy
- Tematy:
-
CAD programs
UV
adhesive joints
cohesion
programy CAD
połączenia klejowe
spójność - Opis:
- The role of adhesive technology in industry has increased significantly in recent times. The need to transfer ever-greater stresses while reducing the mass of devices causes difficulties in engineering. The use of dissimilar materials prioritise this technology. Special equipment is required to ensure the right technological conditions. CAD software facilitates the creation of a virtual design to meet the formulated requirements. This article presents the method of designing the instrumentation allowing to conduct the study of adhesives cured by UV rays.
- Źródło:
-
Journal of Technology and Exploitation in Mechanical Engineering; 2018, 4, 1; 1-9
2451-148X - Pojawia się w:
- Journal of Technology and Exploitation in Mechanical Engineering
- Dostawca treści:
- Biblioteka Nauki
Artykuł