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Wyszukujesz frazę "paste" wg kryterium: Temat


Wyświetlanie 1-3 z 3
Tytuł:
Sacrificial paste for fabrication of ceramic materials by layer-by-layer method
Autorzy:
Falkowski, P.
Scisel, K.
Powiązania:
https://bibliotekanauki.pl/articles/353745.pdf
Data publikacji:
2016
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
sacrificial paste
UV curing
soft lithography
tape casting
alumina
Opis:
The aim of the work was to develop a sacrificial paste suitable for securing channels during shaping of ceramic materials with internal structures via combination of tape casting and soft lithography. Poly(ethylene glycol) methyl ether and polyethylene glycols with different molecular weight were selected as a main components of a sacrificial paste due to their compatibility to UV curable dispersion. The research shows that sacrificial paste should be characterized by proper melting point. This goal was achieved by using a composition of PEG600 with 15wt.%PEG20000 and 10wt.% carbon. The invented sacrificial paste solidify beyond 27°C (melting point). After heating up to 80°C the viscosity of paste is low enough and easily fills the channels with diameter of 150-300uni. What is more, the operational time during free cooling from 80°C to solidification is around 8 minutes what gives enough time for application. Carbon was added as a modifier of rheological properties and as a black dye that helps in visual evaluation of a degree of filling channel. The first test proved that proposed method of preparation of ceramic samples with application of invented sacrificial paste is reliable and can be practically applied.
Źródło:
Archives of Metallurgy and Materials; 2016, 61, 3; 1459-1464
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Die Attachment Method on a Cu Finish by Pressure-Assisted Sinter Bonding in Air Using Cu Formate Paste
Autorzy:
Jo, Kyeong Hwan
Lee, Jong-Hyun
Powiązania:
https://bibliotekanauki.pl/articles/351336.pdf
Data publikacji:
2020
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
die attach
Cu formate paste
sinter bonding
Cu finish
shear strength
Opis:
A paste containing Cu(II) formate rods was prepared, and characteristics of sinter bonding at 250°C under a pressure of 10 MPa were investigated to accomplish a high-speed die attachment for wide-bandgap power chips on Cu finish in air. Synthesisn of the plate-type Cu formate particles from CuO was accomplished through a wet reaction for 180 min. Cu, formed in situ in the bondline by pyrolysis of the formate during heating for the attachment, was sufficiently active to lead high-speed sintering within a carbon dioxide-hydrogen atmosphere derived from the pyrolysis, and the oxide layer on the Cu finish was reduced by the hydrogen. As a result, sinter bonding for 10 min formed a robust bonding with a shear strength approaching 27 MPa.
Źródło:
Archives of Metallurgy and Materials; 2020, 65, 3; 1057-1061
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Effect of Glass-Coated Al Paste on Back-Surface Field Formation in Si Solar Cells
Autorzy:
Jeong, Hyeondeok
Ryu, Sung-Soo
Powiązania:
https://bibliotekanauki.pl/articles/354208.pdf
Data publikacji:
2020
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
Si solar cell
Al paste
glass coating
Al back contact
back surface field
Opis:
In this study, glass frit was coated uniformly on the surface of Al particles instead of adding glass frit to Al powder by simple mixing to form a nano-layer. The influence of the glass-frit coating on the formation of the back-surface field and electrical characteristics of the resulting Al electrode were investigated. Microstructural observations indicated that the glass components were uniformly distributed and the back-surface field layer thickness was more uniform compared to the simply mixed sample. Inaddition, the sheet resistance was ˂10 mΩ/□, much lower than the 23 mΩ/□ of the simply mixed Al electrode.
Źródło:
Archives of Metallurgy and Materials; 2020, 65, 3; 989-992
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
    Wyświetlanie 1-3 z 3

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