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    Wyświetlanie 1-8 z 8
    Tytuł:
    The Influence of Ag2Te Addition on Thermoelectric Properties of Bismuth Telluride
    Autorzy:
    Drzewowska, Sylwia
    Lan, Tian-Wey
    Onderka, Bogusław
    Powiązania:
    https://bibliotekanauki.pl/articles/2048873.pdf
    Data publikacji:
    2022
    Wydawca:
    Polska Akademia Nauk. Czytelnia Czasopism PAN
    Tematy:
    thermoelectric materials
    Seebeck coefficient
    resistivity
    thermal diffusivity
    Bi2Te3-Ag2Te system
    Opis:
    The resistivity, Seebeck coefficient and thermal diffusivity were determined for BiTe3 + Ag2Te composite mixtures. Subsequent measurements were carried out in the temperature range from 20 to 270°C, and for compositions from pure Bi2Te3 to xAg2Te = 0.65 selected along the pseudo-binary section of Ag-Bi-Te ternary system. It was found that conductivity vs. temperature dependence shows visible jump between 140 and 150°C in samples with highest Ag2Te content, which is due to monoclinic => cubic Ag2Te phase transformation. Measured Seebeck coefficient is negative for all samples indicating they are n-type semiconductors. Evaluated power factor is of the order 1.52·10-3 and it decreases with increasing Ag2Te content (at. %). Recalculated thermal conductivity is of the order of unity in W/(m K), and is decreasing with Ag2Te addition. Finally, evaluated Figure of Merit is 0.43 at 100°C and decreases with temperature rise.
    Źródło:
    Archives of Metallurgy and Materials; 2022, 67, 1; 5-15
    1733-3490
    Pojawia się w:
    Archives of Metallurgy and Materials
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Dilatometric Analysis of the Sintering Behavior of Bi2Te3 Thermoelectric Powders
    Autorzy:
    Han, Ju-Yeon
    Byun, Jong Min
    Lee, Young-In
    Choi, Byung Joon
    Kim, Hogyoung
    Oh, Sung-Tag
    Powiązania:
    https://bibliotekanauki.pl/articles/354899.pdf
    Data publikacji:
    2020
    Wydawca:
    Polska Akademia Nauk. Czytelnia Czasopism PAN
    Tematy:
    Bi2Te3
    dilatometric analysis
    sintering behavior
    microstructure
    Opis:
    The sintering behavior of p-type bismuth telluride powder is investigated by means of dilatometric analysis. The alloy powders, prepared by ball milling of melt-spun ribbons, exhibit refined and flake shape. Differential thermal analysis reveals that the endothermic peak at about 280°C corresponds to the melting of bismuth, and peaks existing between 410°C and 510°C are presumably due to the oxidation and crystallization of the powder. The shrinkage behavior of ball-milled powders was strongly dependent of heating rate by the thermal effect exerted on specimens. In the case of 2°C/min, the peak temperature for the densification is measured at 406°C, while the peak temperature at a heating rate of 20°C/min is approximately 443°C. The relative density of specimen pressureless-sintered at 500°C exhibited relatively low value, and thus further study is required in order to increase the density of sintered body.
    Źródło:
    Archives of Metallurgy and Materials; 2020, 65, 3; 1117-1120
    1733-3490
    Pojawia się w:
    Archives of Metallurgy and Materials
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Effect of Electroless Ni–P Plating on the Bonding Strength of Bi–Te-Based Thermoelectric Modules
    Autorzy:
    Kim, S. S.
    Son, I.
    Kim, K. T.
    Powiązania:
    https://bibliotekanauki.pl/articles/356583.pdf
    Data publikacji:
    2017
    Wydawca:
    Polska Akademia Nauk. Czytelnia Czasopism PAN
    Tematy:
    thermoelectric
    Ni–P plating
    bonding strength
    Bi–Te
    soldering
    Opis:
    In the present study, electroless Ni–P plating was applied to Bi–Te-based thermoelectric materials as a barrier layer and the effect of the Ni–P plating on the bonding strength of the thermoelectric module was investigated. The bonding strength of the n- and p-type modules increased after being subjected to the electroless Ni–P plating treatment. In the case of the thermoelectric module that was not subjected to electroless Ni–P plating, Sn and Te were interdiffused and formed a brittle Sn–Te-based metallic compound. The shearing mostly occurred on the bonding interface where such an intermetallic compound was formed. On the other hands, it was found from the FE-EPMA analysis of the bonding interface of thermoelectric module subjected to electroless Ni-P plating that the electroless Ni-P plating acted as an anti-diffusion layer, preventing the interdiffusion of Sn and Te. Therefore, by forming such an anti-diffusion layer on the surface of the Bi–Te based thermoelectric element, the bonding strength of the thermoelectric module could be increased.
    Źródło:
    Archives of Metallurgy and Materials; 2017, 62, 2B; 1225-1229
    1733-3490
    Pojawia się w:
    Archives of Metallurgy and Materials
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Sn-Pd-Ni Electroplating on Bi2Te3-Based Thermoelectric Elements for Direct Thermocompression Bonding and Creation of a Reliable Bonding Interface
    Autorzy:
    Kang, Seok Jun
    Bae, Sung Hwa
    Son, Injoon
    Powiązania:
    https://bibliotekanauki.pl/articles/2049169.pdf
    Data publikacji:
    2021
    Wydawca:
    Polska Akademia Nauk. Czytelnia Czasopism PAN
    Tematy:
    tin electroplating
    thermoelectric module
    thermocompression bonding
    Bi2Te3
    direct bonding
    Opis:
    The Sn-Ag-Cu-based solder paste screen-printing method has primarily been used to fabricate Bi2Te3-based thermoelectric (TE) modules, as Sn-based solder alloys have a low melting temperature (approximately 220°C) and good wettability with Cu electrodes. However, this process may result in uneven solder thickness when the printing pressure is not constant. Therefore, we suggested a novel direct-bonding method between the Bi2Te3-based TE elements and the Cu electrode by electroplating a 100 μm Sn/ 1.3 μm Pd/ 3.5 μm Ni bonding layer onto the Bi2Te3-based TE elements. It was determined that there is a problem with the amount of precipitation and composition depending on the pH change, and that the results may vary depending on the composition of Pd. Thus, double plating layers were formed, Ni/Pd, which were widely commercialized. The Sn/Pd/Ni electroplating was highly reliable, resulting in a bonding strength of 8 MPa between the thermoelectric and Cu electrode components, while the Pd and Ni electroplated layer acted as a diffusion barrier between the Sn layer and the Bi2Te3 TE. This process of electroplating Sn/Pd/Ni onto the Bi2Te3 TE elements presents a novel method for the fabrication of TE modules without using the conventional Sn-alloy-paste screen-printing method.
    Źródło:
    Archives of Metallurgy and Materials; 2021, 66, 4; 963-966
    1733-3490
    Pojawia się w:
    Archives of Metallurgy and Materials
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Structural, Mechanical and Thermodynamic Properties Under Pressure Effect of Rubidium Telluride: First Principle Calculations
    Autorzy:
    Bidai, K.
    Ameri, M.
    Ameri, I.
    Bensaid, D
    Slamani, A.
    Zaoui, A.
    Al-Douri, Y.
    Powiązania:
    https://bibliotekanauki.pl/articles/354182.pdf
    Data publikacji:
    2017
    Wydawca:
    Polska Akademia Nauk. Czytelnia Czasopism PAN
    Tematy:
    Anti-fluorite: Rb2Te; FP-LAPW; GGA
    structural properties
    thermodynamics properties
    elastic constants
    Opis:
    First-principles density functional theory calculations have been performed to investigate the structural, elastic and thermodynamic properties of rubidium telluride in cubic anti-fluorite (anti-CaF2-type) structure. The calculated ground-state properties of Rb2Te compound such as equilibrium lattice parameter and bulk moduli are investigated by generalized gradient approximation (GGA-PBE) that are based on the optimization of total energy. The elastic constants, Young’s and shear modulus, Poisson ratio, have also been calculated. Our results are in reasonable agreement with the available theoretical and experimental data. The pressure dependence of elastic constant and thermodynamic quantities under high pressure are also calculated and discussed.
    Źródło:
    Archives of Metallurgy and Materials; 2017, 62, 2A; 865-871
    1733-3490
    Pojawia się w:
    Archives of Metallurgy and Materials
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Investigation of the Microstructure and Thermoelectric Properties of P-Type BiSbTe Alloys by Usage of Different Revolutions Per Minute (RPM) During Mechanical Milling
    Autorzy:
    Yoon, S.-M.
    Madavali, B.
    Yoon, Y.-N.
    Hong, S.-J.
    Powiązania:
    https://bibliotekanauki.pl/articles/354749.pdf
    Data publikacji:
    2017
    Wydawca:
    Polska Akademia Nauk. Czytelnia Czasopism PAN
    Tematy:
    Bi0.5Sb1.5Te3 alloys
    mechanical alloying
    spark plasma sintering
    thermoelectric properties
    Opis:
    In this work, p-type Bi0.5Sb1.5Te3 alloys were fabricated by high-energy ball milling (MA) and spark plasma sintering. Different revolutions per minute (RPM)s were used in the MA process, and their effect on microstructure, and thermoelectric properties of p-type Bi0.5Sb1.5Te3 were systematically investigated. The crystal structure of milled powders and sintered samples were characterized using X-ray diffraction. All the powders exhibited the same morphology albeit with slight differences find at 1100 RPM conditions. A slight grain size refinement was observed on the fracture surfaces from 500 to 1100 RPM specimens. The temperature dependence of Seebeck coefficient, electrical conductivity, and power factors were measured as a function of temperature with different RPM conditions. The power factor shows almost same (~3.5 W/mK2 at RT) for all samples due to unchanged Seebeck and electrical conductivity values. The peak ZT of 1.07 at 375K is obtained for 1100 RPM specimen due to low thermal conductivity.
    Źródło:
    Archives of Metallurgy and Materials; 2017, 62, 2B; 1167-1171
    1733-3490
    Pojawia się w:
    Archives of Metallurgy and Materials
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Reduction of Thermal Conductivity through the Dispersion of TiC Nanoparticles into a p-Type Bi0.5Sb1.5Te3 Alloy by Ball Milling and Spark Plasma Sintering
    Autorzy:
    Nagarjuna, Cheenepalli
    Madavali, Babu
    Lee, Myeong-Won
    Yoon, Suk-Min
    Hong, Soon-Jik
    Powiązania:
    https://bibliotekanauki.pl/articles/355940.pdf
    Data publikacji:
    2019
    Wydawca:
    Polska Akademia Nauk. Czytelnia Czasopism PAN
    Tematy:
    Bi0.5Sb1.5Te3 alloys
    nanocomposites
    ball milling
    spark plasma sintering
    thermoelectric properties
    Opis:
    The dispersion of nanoparticles in the host matrix is a novel approach to enhance the thermoelectric performance. In this work, we incorporate the TiC (x = 0, 1 and 2 wt.%) nanoparticles into a p-type Bi0.5Sb1.5Te3 matrix, and their effects on microstructure and thermoelectric properties were systematically investigated. The existence of TiC contents in a base matrix was confirmed by energy dispersive X-ray spectroscopy analysis. The grain size decreases with increasing the addition of TiC content due to grain boundary hardening where the dispersed nanoparticles acted as pinning points in the entire matrix. The electrical conductivity significantly decreased and the Seebeck coefficient was slightly enhanced, which attributes to the decrease in carrier concentration by the addition of TiC content. Meanwhile, the lowest thermal conductivity of 0.97 W/mK for the 2 wt.% TiC nanocomposite sample, which is ~16% lower than 0 wt.% TiC sample. The maximum figure of merit of 0.90 was obtained at 350 K for the 0 wt.% TiC sample due to high electrical conductivity. Moreover, the Vickers hardness was improved with increase the addition of TiC contents.
    Źródło:
    Archives of Metallurgy and Materials; 2019, 64, 2; 551-557
    1733-3490
    Pojawia się w:
    Archives of Metallurgy and Materials
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
    Tytuł:
    Effect of Ga2O3 Nanoparticles Dispersion on Microstructure and Thermoelectric Properties of p-Type BiSbTe Based Alloys
    Autorzy:
    Kim, E.-B.
    Koo, J.-M.
    Hong, S.-J.
    Powiązania:
    https://bibliotekanauki.pl/articles/351366.pdf
    Data publikacji:
    2017
    Wydawca:
    Polska Akademia Nauk. Czytelnia Czasopism PAN
    Tematy:
    thermoelectric properties
    Bi0.5Sb1.5Te3 alloys
    Seebeck coefficient
    mechanical alloying
    spark plasma sintering
    Opis:
    In this study, p-type Bi0.5Sb1.5Te3 based nanocomposites with addition of different weight percentages of Ga2O3 nanoparticles are fabricated by mechanical milling and spark plasma sintering. The fracture surfaces of all Bi0.5Sb1.5Te3 nanocomposites exhibited similar grain distribution on the entire fracture surface. The Vickers hardness is improved for the Bi0.5Sb1.5Te3 nanocomposites with 6 wt% added Ga2O3 due to exhibiting fine microstructure, and dispersion strengthening mechanism. The Seebeck coefficient of Bi0.5Sb1.5Te3 nanocomposites are significantly improved owing to the decrease in carrier concentration. The electrical conductivity is decreased rapidly upon the addition of Ga2O3 nanoparticle due to increasing carrier scattering at newly formed interfaces. The peak power factor of 3.24 W/mK2 is achieved for the base Bi0.5Sb1.5Te3 sintered bulk. TheBi0.5Sb1.5Te3 nanocomposites show low power factor than base sample due to low electrical conductivity.
    Źródło:
    Archives of Metallurgy and Materials; 2017, 62, 2B; 993-997
    1733-3490
    Pojawia się w:
    Archives of Metallurgy and Materials
    Dostawca treści:
    Biblioteka Nauki
    Artykuł
      Wyświetlanie 1-8 z 8

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