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Tytuł:
Thermal, Structural and Electrical Properties of Some Bi-Cu-Ni Alloys
Struktura, właściwości termiczne i elektryczne wybranych stopów Bi-Cu-Ni
Autorzy:
Marković, B.
Živković, D.
Manasijeyić, D.
Sokić, M.
Minić, D.
Talijan, N.
Stajić-Trošić, J.
Powiązania:
https://bibliotekanauki.pl/articles/353349.pdf
Data publikacji:
2014
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
Bi-Cu-Ni alloys
lead-free solders
characterization
stopy Bi-Cu-Ni
luty bezołowiowe
charakterystyka
Opis:
The Bi-Cu-Ni ternary system belongs to the group of potential Cu-Ni-based advanced lead-free solder materials for high temperature application. In this study microstructure investigation of the slow-cooled Bi-Cu-Ni samples was done using SEM-EDS analysis. The samples compositions were chosen along three cross-sections with molar ratio Cu:Ni=1:3, 1:1 and 3:1. The experimentally obtained phase structure was compared with the results of thermodynamic calculation according to CALPHAD method. Also, new results regarding thermal and electrical properties investigations of these alloys are presented in this paper, based on DSC and electroconductivity measurements.
Trójskładnikowe stopy Bi-Cu-Ni należą do grupy potencjalnych zaawansowanych bezołowiowych materiałów do lutowania w wysokiej temperaturze opartych na stopach Cu-Ni. Analizę mikrostruktury wolno schłodzonych próbek Bi-Cu-Ni wykonano za pomocą technik SEM-EDS. Do badań wybrano próbki charakteryzujące się stałym molowym stosunkiem Cu:Ni=1:3, 1:1 i 3:1. Doświadczalnie otrzymaną strukturę faz porównano z wynikami obliczeń termodynamicznych metodą CALPHAD. Ponadto, nowe wyniki dotyczące badań właściwości cieplnych i elektrycznych stopów zostały przedstawione w tym artykule, na podstawie pomiarów DSC i przewodności elektrycznej.
Źródło:
Archives of Metallurgy and Materials; 2014, 59, 1; 117-120
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Application of Thermo-Bimaterial Effect in Designing of Snap-Fit Joints
Autorzy:
Golewski, P.
Sadowski, T.
Powiązania:
https://bibliotekanauki.pl/articles/351310.pdf
Data publikacji:
2019
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
snap fit joint
numerical simulation
bi-material
Opis:
Snap-fit connections have been used for many years in various fields of technology and everyday objects. They often have complex shapes, which is allowed by the processing technology of the polymers from which they are made, but they are not designed to carry loads. Changing the material to a metal or fiber composite allows these types of joints to be used as replacements for rivets or screws, but there are problems with the closing technique – an increase in closing force due to the large Young’s modulus ofthese materials relative to polymers without reinforcement. One of the methods to solve this problem may be the use of a thermo-bimetallic effect consisting in heating both or one of the connection parts to the appropriate temperature. This kind of treatment results in deflection of the beam of the clip (Fig. 1), followed by assembly with zero force or less in relation to the case without heating.The paper presents the results of numerical simulations for the connection in which the beam of the clip consisted of two materials: (1) a fiber composite designed to carry loads, (2) thin metal layer tied with the composite and designed to create a thermo-bimetallic effect. In the case of this solution, the main parameter is the difference in coefficients of linear thermal expansion of both materials. The paper presents results for two cases of connection work: closing and opening. The calculations were carried out in the Abaqus/Standard solver using thermal-displacement steps.
Źródło:
Archives of Metallurgy and Materials; 2019, 64, 3; 1095-1100
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Dilatometric Analysis of the Sintering Behavior of Bi2Te3 Thermoelectric Powders
Autorzy:
Han, Ju-Yeon
Byun, Jong Min
Lee, Young-In
Choi, Byung Joon
Kim, Hogyoung
Oh, Sung-Tag
Powiązania:
https://bibliotekanauki.pl/articles/354899.pdf
Data publikacji:
2020
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
Bi2Te3
dilatometric analysis
sintering behavior
microstructure
Opis:
The sintering behavior of p-type bismuth telluride powder is investigated by means of dilatometric analysis. The alloy powders, prepared by ball milling of melt-spun ribbons, exhibit refined and flake shape. Differential thermal analysis reveals that the endothermic peak at about 280°C corresponds to the melting of bismuth, and peaks existing between 410°C and 510°C are presumably due to the oxidation and crystallization of the powder. The shrinkage behavior of ball-milled powders was strongly dependent of heating rate by the thermal effect exerted on specimens. In the case of 2°C/min, the peak temperature for the densification is measured at 406°C, while the peak temperature at a heating rate of 20°C/min is approximately 443°C. The relative density of specimen pressureless-sintered at 500°C exhibited relatively low value, and thus further study is required in order to increase the density of sintered body.
Źródło:
Archives of Metallurgy and Materials; 2020, 65, 3; 1117-1120
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Effect of Electroless Ni–P Plating on the Bonding Strength of Bi–Te-Based Thermoelectric Modules
Autorzy:
Kim, S. S.
Son, I.
Kim, K. T.
Powiązania:
https://bibliotekanauki.pl/articles/356583.pdf
Data publikacji:
2017
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
thermoelectric
Ni–P plating
bonding strength
Bi–Te
soldering
Opis:
In the present study, electroless Ni–P plating was applied to Bi–Te-based thermoelectric materials as a barrier layer and the effect of the Ni–P plating on the bonding strength of the thermoelectric module was investigated. The bonding strength of the n- and p-type modules increased after being subjected to the electroless Ni–P plating treatment. In the case of the thermoelectric module that was not subjected to electroless Ni–P plating, Sn and Te were interdiffused and formed a brittle Sn–Te-based metallic compound. The shearing mostly occurred on the bonding interface where such an intermetallic compound was formed. On the other hands, it was found from the FE-EPMA analysis of the bonding interface of thermoelectric module subjected to electroless Ni-P plating that the electroless Ni-P plating acted as an anti-diffusion layer, preventing the interdiffusion of Sn and Te. Therefore, by forming such an anti-diffusion layer on the surface of the Bi–Te based thermoelectric element, the bonding strength of the thermoelectric module could be increased.
Źródło:
Archives of Metallurgy and Materials; 2017, 62, 2B; 1225-1229
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Thermodynamic Assessment Of The Bi-In-Zn System
Termodynamiczny opis układu Bi-In-Zn
Autorzy:
Onderka, B.
Dębski, A.
Gąsior, W.
Powiązania:
https://bibliotekanauki.pl/articles/352218.pdf
Data publikacji:
2015
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
Bi-In-Zn alloys
phase diagram
differential thermal analysis (DTA)
phase equilibria
stopy Bi-In-Zn
diagram fazowy
różnicowa analiza termiczna DTA
równowagi fazowe
Opis:
A thermodynamic description of the entire ternary Bi-In-Zn system was obtained by the CALPHAD modelling of the Gibbs energy of the liquid phase. The experimental data on the phase equilibria and the thermodynamic properties published and complemented by the authors’ own experiments were taken into account. In order to verify the phase equilibria in the Bi-In-Zn system, 15 different samples were studied in the temperature range of 300-900 K by the DTA technique during heating and cooling cycles. Coexisting phases and their composition were analyzed by the SEM and EDX techniques for 9 distinct samples after their thermal equilibration at 373 K and 473 K. Assessment and selected phase equilibrium calculations were performed with ThermoCalc and Pandat softwares, and compared with experimental data. The obtained results reproduce well the experimental data on both the phase equilibria and the thermodynamic properties in the optimized system.
Z pomocą metody Calphad opracowano termodynamiczny model energii swobodnej Gibbsa fazy ciekłej w układzie fazowym Bi-In-Zn, co pozwoliło na termodynamiczny opis tego układu jako całości. Zastosowano własne i literaturowe dane eksperymentalne dotyczące równowag fazowych i właściwości termodynamicznych faz układu trójskładnikowego. W celu weryfikacji uzyskanego opisu wykonano pomiary DTA w zakresie temperatury 300-900 K dla 15 próbek stopów o różnych składach w kolejnych cyklach nagrzewania i studzenia. Równowagę fazową badano analizując technikami SEM i EDX skład fazowy i wzajemną rozpuszczalność składników wygrzewanych izotermicznie stopów w temperaturze 373 K i 473 K. Optymalizację parametrów modelowych i obliczenia termodynamiczne w układzie Bi-In-Zn wykonano za pomocą oprogramowania ThermoCalc i Pandat. Porównując obliczone równowagi fazowe i funkcje termodynamiczne z danymi doświadczalnymi stwierdzono bardzo dobrą zgodność wielkości eksperymentalnych z właściwościami topologicznymi i termodynamicznymi zoptymalizowanego układu.
Źródło:
Archives of Metallurgy and Materials; 2015, 60, 2A; 567-575
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Surface Tension of Cu – Bi Alloys And Wettability in a Liquid Alloy – Refractory Material – Gaseous Phase System
Napięcie powierzchniowe stopów Cu – Bi oraz zwilżalność w układzie: ciekły stop – materiał ogniotrwały – faza gazowa
Autorzy:
Oleksiak, B.
Łabaj, J.
Wieczorek, J.
Blacha-Grzechnik, A.
Burdzik, R.
Powiązania:
https://bibliotekanauki.pl/articles/354400.pdf
Data publikacji:
2014
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
surface tension
contact angle
wettability
sessile drop method
high-temperature microscope
liquid Cu-Bi alloys
napięcie powierzchniowe
zwilżalność
metoda kropli leżącej
mikroskop wysokotemperaturowy
ciekłe stopy Cu-Bi
Opis:
The study involved measurements of surface tension of liquid binary copper-bismuth alloys with respect to their chemical composition and temperature as well as investigations of the liquid alloy - refractory material - gaseous phase system wettability using usual refractory materials, i.e. aluminium oxide, magnesium oxide and graphite. The experiments were performed with the use of sessile drop method and a high-temperature microscope coupled with a camera and a computer was utilised.
W ramach pracy przeprowadzone zostały pomiary napięcia powierzchniowego ciekłych dwuskładnikowych stopów miedzi z bizmutem, w funkcji składu chemicznego i temperatury oraz badania zwilżalności w układzie: ciekły stop- materiał ogniotrwały-faza gazowa z wykorzystaniem typowych materiałów ogniotrwałych, to jest tlenku glinu, tlenku magnezu oraz grafitu. Badania wykonano metodą kropli leżącej, przy użyciu mikroskopu wysokotemperaturowego sprzężonego z kamerą i komputerem.
Źródło:
Archives of Metallurgy and Materials; 2014, 59, 1; 281-285
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Sn-Pd-Ni Electroplating on Bi2Te3-Based Thermoelectric Elements for Direct Thermocompression Bonding and Creation of a Reliable Bonding Interface
Autorzy:
Kang, Seok Jun
Bae, Sung Hwa
Son, Injoon
Powiązania:
https://bibliotekanauki.pl/articles/2049169.pdf
Data publikacji:
2021
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
tin electroplating
thermoelectric module
thermocompression bonding
Bi2Te3
direct bonding
Opis:
The Sn-Ag-Cu-based solder paste screen-printing method has primarily been used to fabricate Bi2Te3-based thermoelectric (TE) modules, as Sn-based solder alloys have a low melting temperature (approximately 220°C) and good wettability with Cu electrodes. However, this process may result in uneven solder thickness when the printing pressure is not constant. Therefore, we suggested a novel direct-bonding method between the Bi2Te3-based TE elements and the Cu electrode by electroplating a 100 μm Sn/ 1.3 μm Pd/ 3.5 μm Ni bonding layer onto the Bi2Te3-based TE elements. It was determined that there is a problem with the amount of precipitation and composition depending on the pH change, and that the results may vary depending on the composition of Pd. Thus, double plating layers were formed, Ni/Pd, which were widely commercialized. The Sn/Pd/Ni electroplating was highly reliable, resulting in a bonding strength of 8 MPa between the thermoelectric and Cu electrode components, while the Pd and Ni electroplated layer acted as a diffusion barrier between the Sn layer and the Bi2Te3 TE. This process of electroplating Sn/Pd/Ni onto the Bi2Te3 TE elements presents a novel method for the fabrication of TE modules without using the conventional Sn-alloy-paste screen-printing method.
Źródło:
Archives of Metallurgy and Materials; 2021, 66, 4; 963-966
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
X-Ray Diffraction Study of Bismuth Layer-Structured Multiferroic Ceramics
Autorzy:
Lisińska-Czekaj, A.
Czekaj, D.
Garbarz-Glos, B.
Bąk, W.
Kuźniarska-Biernacka, I.
Powiązania:
https://bibliotekanauki.pl/articles/355806.pdf
Data publikacji:
2020
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
Bi5FeTi3O15 ceramics
X-ray diffraction
crystal structure
Opis:
Goal of the present research was to apply a solid state reaction route to fabricate bismuth layer-structured multiferroic ceramics described with the formula Bi5FeTi3O15 and reveal the influence of processing conditions on its crystal structure and phase composition. Simple oxide powders Bi2O3, TiO2 and Fe2O3 were used to fabricate Aurivillius-type bismuth layer-structured ferroelectrics. Pressureless sintering in ambient air was employed and the sintering temperature was TS = 900°C, TS = 1000°C and TS = 1040°C. The phase composition as well as crystal structure of ceramics sintered at various processing conditions was examined with powder X-ray diffraction method at room temperature. The Rietveld refinement method was applied for analysis of X-ray diffraction data. It was found that ceramics adopted orthorhombic structure Cmc21. The unit cell parameters of bismuth layer-structured multiferroic ceramics increased slightly with an increase in sintering temperature.
Źródło:
Archives of Metallurgy and Materials; 2020, 65, 2; 811-815
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Effect of Cone Size on the Bonding Strength of Bimetallic Composite Pipes Produced by Drawing Approach
Autorzy:
Zheng, M.
Zhao, T.
Gao, H.
Teng, H.
Hu, J.
Powiązania:
https://bibliotekanauki.pl/articles/352274.pdf
Data publikacji:
2018
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
bi-metallic composite pipe
drawing approach
cone size
interfacial bonding strength
ideal elastoplastic
Opis:
The effect of cone size on interfacial bonding strength of bimetallic composite pipe manufactured by drawing approach is studied on base of the plane strain assumption and ideal elastic-plastic model, a simple expression for the effect of cone size on the bonding strength of bimetallic composite pipes is proposed. The agreement of the predicted results with the experimental results shows the reliability.
Źródło:
Archives of Metallurgy and Materials; 2018, 63, 1; 451-456
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
The Effect of Ho Doping Contents on the Structural, Microstructure and Dielectric Properties of Bi5Ti3FeO15 Aurivillius Ceramics
Autorzy:
Tomaszewska, M.
Dzik, J.
Wodecka-Duś, B.
Pikula, T.
Adamczyk-Habrajska, M.
Szalbot, D.
Chocyk, D.
Powiązania:
https://bibliotekanauki.pl/articles/2049646.pdf
Data publikacji:
2021
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
ceramics
Bi5Ti3FeO15
Ho3+ doping
microstructure
structure
dielectric properties
Opis:
Aurivillius Bi5-xHoxTi3FeO15 (BHTFO) multiferroic ceramics with different holmium doping contents were synthesized by conventional solid state reaction. The effect of holmium doping on the microstructure, structural and dielectric behaviors of BHTFO ceramics were investigated in details. Microstructure and crystalline structure studies of ceramics were carried out at room temperature while dielectric properties were investigated in a wide range of temperature (T = 25ºC-550ºC) and frequency (20Hz-1MHz).
Źródło:
Archives of Metallurgy and Materials; 2021, 66, 1; 91-96
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Synthesis and Dielectric Properties of Nd Doped Bi5Ti3FeO15 Ceramics
Autorzy:
Kocoń, N.
Dzik, Jolanta
Szalbot, Diana
Pikula, Tomasz
Adamczyk-Habrajska, Małgorzata
Wodecka-Duś, Beata
Powiązania:
https://bibliotekanauki.pl/articles/2049659.pdf
Data publikacji:
2021
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
ceramics
sintering
Bi5Ti3FeO15
Nd3+ doping
microstructure
dielectric properties
Opis:
Aurivillius Bi5Ti3Feo15 (BTF) and Bi5-xNdxTi3Feo15 (BNTF) ceramics were successfully synthesized by a simple solid state reaction method. Ceramics were prepared from simple oxide powders Bi2O3, TiO2, Nd2O3 and Fe2O3. The microstructure, structure, chemical composition and dielectric properties of the obtained materials were examined. Dielectric properties were investigated in a wide range of temperatures (T = 25ºC-550ºC) and frequencies (20Hz-1MHz).
Źródło:
Archives of Metallurgy and Materials; 2021, 66, 2; 359-365
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Correlation Between Structure, Microstructure and Dielectric Properties of Bi7Fe3Ti3O21 Ceramics Obtained in Different Conditions
Autorzy:
Szalbot, D.
Bartkowska, J. A.
Feliksik, K.
Bara, M.
Chrunik, M.
Adamczyk-Habrajska, M.
Powiązania:
https://bibliotekanauki.pl/articles/356042.pdf
Data publikacji:
2020
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
multiferroic materials
Aurivillius phases
Bi7Fe3Ti3O21
dielectric properties
Opis:
Multiferroic six-layer Aurivillius type Bi7Fe3Ti3O21 ceramics was obtained by conventional mixed oxides method. The final sintering process was taken in several different sintering times, which determined changes in properties of discussed ceramic material. The structure and dielectric properties of the material are reported. In order to examine the technological conditions on the crystal structure, XRD analysis was carried out. The microstructure, as well as the quantitative and qualitative analysis of the chemical composition were investigated by scanning electron microscope with an energy dispersion spectrometer. The main purpose of the paper is to present the effect of sintering time on the microstructure, crystallographic structure and dielectric properties of Bi7Fe3Ti3O21 ceramics.
Źródło:
Archives of Metallurgy and Materials; 2020, 65, 2; 879-884
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
The Influence of Ag2Te Addition on Thermoelectric Properties of Bismuth Telluride
Autorzy:
Drzewowska, Sylwia
Lan, Tian-Wey
Onderka, Bogusław
Powiązania:
https://bibliotekanauki.pl/articles/2048873.pdf
Data publikacji:
2022
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
thermoelectric materials
Seebeck coefficient
resistivity
thermal diffusivity
Bi2Te3-Ag2Te system
Opis:
The resistivity, Seebeck coefficient and thermal diffusivity were determined for BiTe3 + Ag2Te composite mixtures. Subsequent measurements were carried out in the temperature range from 20 to 270°C, and for compositions from pure Bi2Te3 to xAg2Te = 0.65 selected along the pseudo-binary section of Ag-Bi-Te ternary system. It was found that conductivity vs. temperature dependence shows visible jump between 140 and 150°C in samples with highest Ag2Te content, which is due to monoclinic => cubic Ag2Te phase transformation. Measured Seebeck coefficient is negative for all samples indicating they are n-type semiconductors. Evaluated power factor is of the order 1.52·10-3 and it decreases with increasing Ag2Te content (at. %). Recalculated thermal conductivity is of the order of unity in W/(m K), and is decreasing with Ag2Te addition. Finally, evaluated Figure of Merit is 0.43 at 100°C and decreases with temperature rise.
Źródło:
Archives of Metallurgy and Materials; 2022, 67, 1; 5-15
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Low temperature broad band dielectric spectroscopy of multiferroic Bi6Fe2Ti3O18 ceramics
Autorzy:
Lisińska-Czekaj, A.
Rerak, M.
Czekaj, D.
Lubina, M.
Garbarz-Glos, B.
Bąk, W.
Powiązania:
https://bibliotekanauki.pl/articles/353453.pdf
Data publikacji:
2016
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
low temperature
broad band dielectric spectroscopy
multiferroic Bi6Fe2Ti3O18 ceramics
Opis:
In the present research the tool of broadband dielectric spectroscopy was utilized to characterize dielectric behavior of Bi6Fe2Ti3O18is (BFTO) Aurivillius-type multiferroic ceramics. Dielectric response of BFTO ceramics was studied in the frequency domain (Δν=0.1Hz - 10MHz) within the temperature range ΔΤ=-100°C - 200°C. The Kramers-Kronig data validation test was employed to validate the impedance data measurements and it was found that the measured impedance data exhibited good quality justifying further analysis. The residuals were found to be less than 1%, whereas the "chi-square" parameter was within the range χ2~-10-7 -10-5. Experimental data were analyzed using the circle fit of simple impedance arc plotted in the complex Z”-Z` plane (Nyquist plot). The total ac conductivity of the grain boundaries was thus revealed and the activation energy of ac conductivity for the grain boundaries was calculated. It was found that activation energy of ac conductivity of grain boundaries changes from ΕA=0.20eV to ΕA=0.55eV while temperature rises from Τ=-100°C up to Τ=200°C. On the base of maxima of the impedance semicircles (ωmτm=l) the relaxation phenomena were characterized in terms of the temperature dependence of relaxation times and relevant activation energy was calculated (ΕA=0.55eV).
Źródło:
Archives of Metallurgy and Materials; 2016, 61, 3; 1447-1452
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł
Tytuł:
Investigation of the Microstructure and Thermoelectric Properties of P-Type BiSbTe Alloys by Usage of Different Revolutions Per Minute (RPM) During Mechanical Milling
Autorzy:
Yoon, S.-M.
Madavali, B.
Yoon, Y.-N.
Hong, S.-J.
Powiązania:
https://bibliotekanauki.pl/articles/354749.pdf
Data publikacji:
2017
Wydawca:
Polska Akademia Nauk. Czytelnia Czasopism PAN
Tematy:
Bi0.5Sb1.5Te3 alloys
mechanical alloying
spark plasma sintering
thermoelectric properties
Opis:
In this work, p-type Bi0.5Sb1.5Te3 alloys were fabricated by high-energy ball milling (MA) and spark plasma sintering. Different revolutions per minute (RPM)s were used in the MA process, and their effect on microstructure, and thermoelectric properties of p-type Bi0.5Sb1.5Te3 were systematically investigated. The crystal structure of milled powders and sintered samples were characterized using X-ray diffraction. All the powders exhibited the same morphology albeit with slight differences find at 1100 RPM conditions. A slight grain size refinement was observed on the fracture surfaces from 500 to 1100 RPM specimens. The temperature dependence of Seebeck coefficient, electrical conductivity, and power factors were measured as a function of temperature with different RPM conditions. The power factor shows almost same (~3.5 W/mK2 at RT) for all samples due to unchanged Seebeck and electrical conductivity values. The peak ZT of 1.07 at 375K is obtained for 1100 RPM specimen due to low thermal conductivity.
Źródło:
Archives of Metallurgy and Materials; 2017, 62, 2B; 1167-1171
1733-3490
Pojawia się w:
Archives of Metallurgy and Materials
Dostawca treści:
Biblioteka Nauki
Artykuł

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