- Tytuł:
- Investigations of Interface Properties in Copper-Silicon Carbide Composites
- Autorzy:
-
Chmielewski, M.
Pietrzak, K.
Strojny-Nędza, A.
Jarząbek, D.
Nosewicz, S. - Powiązania:
- https://bibliotekanauki.pl/articles/351487.pdf
- Data publikacji:
- 2017
- Wydawca:
- Polska Akademia Nauk. Czytelnia Czasopism PAN
- Tematy:
-
copper matrix composites
silicon carbide
interface
thermal conductivity
adhesion - Opis:
- This paper analyses the technological aspects of the interface formation in the copper-silicon carbide composite and its effect on the material’s microstructure and properties. Cu-SiC composites with two different volume content of ceramic reinforcement were fabricated by hot pressing (HP) and spark plasma sintering (SPS) technique. In order to protect SiC surface from its decomposition, the powder was coated with a thin tungsten layer using plasma vapour deposition (PVD) method. Microstructural analyses provided by scanning electron microscopy revealed the significant differences at metal-ceramic interface. Adhesion force and fracture strength of the interface between SiC particles and copper matrix were measured. Thermal conductivity of composites was determined using laser flash method. The obtained results are discussed with reference to changes in the area of metal-ceramic boundary.
- Źródło:
-
Archives of Metallurgy and Materials; 2017, 62, 2B; 1315-1318
1733-3490 - Pojawia się w:
- Archives of Metallurgy and Materials
- Dostawca treści:
- Biblioteka Nauki
Artykuł