- Tytuł:
- Structure and stress in Au/Cu two-layer system during annealing at different temperature
- Autorzy:
- Chocyk, D.
- Powiązania:
- https://bibliotekanauki.pl/articles/1153076.pdf
- Data publikacji:
- 2016-10
- Wydawca:
- Polska Akademia Nauk. Instytut Fizyki PAN
- Tematy:
-
68.60.Bs
68.60.Dv
68.65.Ac - Opis:
- In this work, the Au/Cu two-layer systems, with the total thickness equal to 30 nm are studied. The two-layer systems were deposited by thermal evaporation in a UHV system on the silicon substrate at room temperature. After deposition the samples were annealed. We examined samples subjected to thermal cycle with the different maximum temperature. The X-ray diffraction and X-ray reflectometry are performed for systems before and after annealing. It was found that during the cycle of annealing above 150°C starts process of penetration of the Au layer by Cu atoms results in alloying. In Au/Cu systems, the final layer is the ordered Au/Cu₃ phase.
- Źródło:
-
Acta Physica Polonica A; 2016, 130, 4; 1118-1120
0587-4246
1898-794X - Pojawia się w:
- Acta Physica Polonica A
- Dostawca treści:
- Biblioteka Nauki
Artykuł