Finite element analysis of thermal stress in Cu2O coating synthesized on Cu substrate

Purpose: The paper aims to find the magnitude and nature of thermal residual stresses that occur during cooling of a copper sample with a thermally synthesized oxide layer of Cu2O. Design/methodology/approach: Thermo-mechanical analysis was performed by the finite element method using Ansys Software. The results of thermal analysis were used to study the resulting stress-strain state of the thin film/coating system after cooling. Findings: Based on the modeling results, the paper determined the most stress-strain areas of the sample with a coating, which are the free edges of the interfaces between the copper substrate and the Cu2O oxide layer. Research limitations/implications: The main limitations of the study are the use of certain simplifications in the condition setup, for instance, uniform cooling of the thin film/coating system, homogeneity and isotropy of substrate and thin film materials, invariance of their properties with temperature changes, etc. Practical implications: The results obtained can be used to control the stress-strain state of the thin film/coating system and prevent deformations and destruction of thin-film structures during their production and operation of products with them. Originality/value: The study of new promising methods for the formation of oxide nanostructures, for instance in a plasma environment, requires a sufficient theoretical basis in addressing the origin and development of stresses.