Fotoreaktwne poliakrylanowe kleje samoprzylepne

Pressure-sensitive adhesives (PSAs) are non-metallic materials used to bond other materials, mainly on their surfaces through adhesion and cohesion. Adhesion and cohesion are phenomena, which may be described thermodynamically and chemically, but actually they cannot be measured precisely. It was shown that the most important bonding processes are bonding by adhesion and bonding with pressure- -sensitive adhesives. The difference between pressure-sensitive adhesives and other adhesives, such as contact adhesives, is in the permanent surface stickiness of the pressure-sensitive adhesives before, or after, the application. The fastest developing polymers departments are: initiating UV photopolymerization and photocrosslinking. Ultraviolet radiation (UV) part of the electromagnetic radiation having a wavelength of 100 to 400 nm, the practical use has an area of 200 to 400 nm. UV radiation does not cause visual impressions results in a strongly fluorescence, photoelectric, photochemical reactions and has a high biological activity. It is particularly important industrial use of UV crosslinking which is used in the manufacture of a wide range of self-adhesives, such as assembly lines, labels, decorative films, protective films, patches and biomedical electrode. Especially important critical point during UV-curing is the balance between adhesion and cohesion of the crosslinked pressure-sensitive adhesive layer. An important element is finding the appropriate beneficial relationship between tack, adhesion and cohesion of the crosslinked pressure-sensitive adhesives that offer assurance to their respective industrial applications. Ultraviolet radiation crosslinking is carried out at room temperature and does not require high temperatures, an important disadvantage pressure-sensitive adhesives crosslinked by heat. Compared to systems crosslinked thermally, the use of UV crosslinking process provides greater speed and effective a crosslinking process, and also does not damage the materials with low thermal resistance.