This paper reports on analyses and testing of sensitive power electronics components
encapsulation concept, enabling operation in harsh, especially high pressure
environments. The paper describes development of the concept of epoxy modules that
can be used for protecting of the power electronics components against harsh environmental
conditions. It covers modeling of the protective capsules using a simple analytical
approach and Finite Element Method (FEM) models and validation of the developed
models with the high pressure tests on samples fabricated. The analyses covered two
types of the epoxy modules: of sphere- and elongated- shape, both with electrical penetrators
that enable electrical connection of the encapsulated components with external power
sources as well as other power modules and components. The tests were conducted
in a pressure chamber, with a maximum applied pressure of 310 bars, for which online
strain measurements have been conducted. The experimental results were compared with
the simulation results obtained with analytical and FEM models, providing validation of
the models employed. The experimental part of this work was conducted in collaboration
with Polish Naval Academy in Gdynia.
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